Features

IBASE unveils next-gen Edge AI solutions at Embedded World 2024

IBASE Technology, a provider in the design and manufacturing of embedded computing solutions, will collaborate with Qualcomm Technologies to showcase next-generation edge AI solutions at the upcoming Embedded World 2024 (April 9-11, 2024). IBASE is on booth 3-351 in hall 3 where you can see solutions for your IoT devices. …

Read More »

The new Beagle has landed at Farnell

Farnell is offering customers the opportunity to pre-order BeagleY-AI, a new, open-source single board computer (SBC) from BeagleBoard.org that enables developers to jump straight into the creation of an expansive new range of AI applications. BeagleY-AI is born from BeagleBoard’s enthusiasm to expand the growth of the open-source hardware ecosystem, …

Read More »

DATA MODUL presents compact expertise in Nuremberg

At this year’s embedded world, DATA MODUL AG will be presenting its full-service orientation in the core competency areas of Hardware, Software and Service. Visitors will have the opportunity to visit the booth of the Munich-based system provider where they can find out more about its expertise and even experience …

Read More »

Hirose develops right-angle crimp socket for popular DF60 series

Hirose, a specialist in the development of connector solutions, has expanded its DF60 Series to include a rugged right-angle crimp socket that offers design flexibility and space-savings in demanding, power-hungry applications. Enabling a compact design, the right-angle DF60FS Series crimp socket has a pitch of only 10.16 mm and does …

Read More »

DigiKey hosts great board giveaway, technical demos and more at Embedded World 2024

DigiKey, a global commerce distributor offering technical components and automation products in stock for immediate shipment, will bring its refreshed brand and Great Board Giveaway to embedded world 2024, April 9-11 in Nuremberg, Germany. The company will host a wide variety of activities, giveaways and resources during the show at …

Read More »

Microchip Technology expands its serial SRAM portfolio to larger densities and increased speeds

To address a common customer need for bigger and faster SRAM, Microchip Technology has expanded its Serial SRAM product line to include larger densities of up to 4 Mb and increased Serial Peripheral Interface/Serial Quad I/O Interface (SPI/SQI) speed to 143 MHz. The 2 Mb and 4 Mb devices are …

Read More »

Mouser Electronics inks global distribution agreement with Morse Micro for long-range Wi-Fi HaLow solutions

Mouser Electronics, the authorised global distributor of electronic components and industrial automation products, has announced a global distribution agreement with Morse Micro, the Wi-Fi HaLow silicon vendor. Through this agreement, Mouser is now stocking Morse Micro’s long-range, ultra-low-power Wi-Fi HaLow modules and development platforms. Morse Micro’s comprehensive portfolio includes, what …

Read More »

MIKROE partners with Allegro MicroSystems to introduce new click boards targeting industrial applications

MikroElektronika, the embedded solutions company, is closely collaborating with Allegro MicroSystems, Inc., a global specialist in power and sensing solutions for motion control and energy-efficient systems, to offer a broad portfolio of products that reduce development effort and accelerate time to market. Over the last quarter, MIKROE has introduced three …

Read More »

NeoCortec to exhibit at Embedded World 2024

NeoCortec, the specialists on wireless connectivity and providers of ultra-low-power bi-directional wireless mesh network hardware and software solutions, will exhibit at Embedded World 2024 in Nuremberg, from 9th April to 11th April 2024 in Hall 3 on stand 526. Visitors to NeoCortec’s stand can learn more about the features of …

Read More »

XMOS, DSP Concepts partner to unlock audio and voice DSP applications

AI and semiconductor expert XMOS has announced its partnership with embedded audio software specialist DSP Concepts. The agreement will allow audio professionals to combine XMOS’ highly-deterministic, low latency xcore.ai platform with DSP Concepts’ Audio Weaver software, which enables users to graphically design and debug audio and voice solutions utilising multicores easily from …

Read More »