Winbond’s new package 100BGA LPDDR4/4X has achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce …
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Farnell, an Avnet company and global distributor of electronic components, products and solutions, has launched a new global campaign with Bourns, Inc. to supply advanced magnetic solutions. Farnell’s longstanding strategic partnership with Bourns is supported by growing customer demand for innovative embedded solutions which are critical to breakthrough electric vehicle …
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Mouser Electronics has produced a new eBook in collaboration with Microchip Technology, exploring the use of embedded microcontrollers in device design. In Effortless Embedded Solutions, industry thought leaders offer unique perspectives on how Microchip microcontrollers can simplify device design for medical, safety, and Internet of Things (IoT) applications. The constantly …
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Antenova, the UK-based manufacturer of antennas and RF antenna modules for M2M and the IoT, has announced a new and smaller SMD antenna for 5G and 4G frequencies. The antenna is named Minima, part number SR4L075. At 40 x 10 x 3.3 mm, Minima is the smallest 5G antenna that …
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Global industrial computer hardware manufacturer and IoT solution provider, OnLogic (www.onlogic.com), has been recognized for excellence in customer satisfaction. The company was named a Gold Vendor as part of VDC Research’s annual Iot & Embedded Technology Vendor Satisfaction Awards. The awards are determined by survey feedback from VDC Research participants …
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Belden, a global supplier of specialty networking solutions, will launch the new Belden Horizon industrial edge solution in July. The powerful new platform meets the fast-growing need for a simpler, seamless, secure, reliable way to connect operational systems at the edge while maintaining security and communication with the cloud. The …
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NXP Semiconductors has announced its collaboration with Plug and Play’s flagship Open Innovation Platform STARTUP AUTOBAHN at their EXPO 2022. The Open Innovation Platform scouts for startups from all over the world with the aim to validate technologies in proof-of-concepts (PoCs) and pilot projects. The primary goal of the platform …
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Crypto Quantique, a specialist in quantum-driven cybersecurity for the internet of things (IoT), has announced a post-quantum computing (PQC) version of its QuarkLink chip-to-cloud IoT security platform. The upgraded platform is believed to be the first to use post-quantum algorithms recently announced for standardization by the National Institute of Standards …
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ARIES Embedded, a specialist in embedded services and products, presents the new embedded boards “MSRZG2UL” and “MSRZFive”, two powerful and versatile system-in-packages (SiP) based on Renesas’ single-core microprocessors RZ/G2UL and RZ/Five. The RZ/G2UL microprocessor includes a Cortex-A55 (1.0 GHz) CPU and a CortexM33 coprocessor, while the RZ/Five has a RISC-V …
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Antenova, the UK-based manufacturer of antennas and RF modules for M2M and the IoT, is launching GNSSNOVA M20071, a new GNSS receiver module, with power consumption reduced five-fold to enable smaller tracker designs, and trackers that run for five times longer. The M20071 module is for small tracking devices that …
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CIE Components in Electronics