ICs & Semiconductors

An embedded algorithm in a new audio system from NXP Semiconductors has been able to boost the output power of micro speakers by over 5 times, dramatically improving the sound quality of mobile devices. By driving over 2.6 watts RMS into micro speakers that have previously been limited to 0.5 W, the TFA9887 IC will give mobile phones, portable music players and tablets much louder sound, deeper bass, and higher sound quality – without risking speaker damage.

Atmel Corporation has unveiled the ATF697FF, the newest member of Atmel’s SPARC V8 processor family and the first radiation-hardened (RAD Hard) high-performance aerospace microprocessor that can be reconfigured on-the-fly. This ability will aloow users to make on-going design modifications to satellites, including specification updates, in-flight adjustments during trial flights and post-launch alterations.

Toshiba Electronics Europe (TEE) has added the TC35896WBG with integrated ESD and EMI protection to its family of miniature, low-power I/O expanders that simplify upgrading of resource-constrained designs or adding off-board I/Os. The device connects up to 20 general-purpose I/Os (GPIO), 96 keyboard lines and three PWM channels to the host system via a 2-wire I2C interface and interrupt connection (IRQ).

InvenSense, a leading developer and provider of MotionTracking devices, is entering into the industrial market with the introduction of the MPU-3300, the world’s first single-chip, high performance integrated 3-axis industrial gyroscope.  Leveraging its high volume production capabilities, InvenSense is looking to provide high performance, high reliability, low power and low cost devices with ultra-precise positioning and monitoring information for industrial applications. 

Ziptronix, a developer of direct bonding technology for advanced semiconductor applications, has licensed its technology for a cell phone handset application. According to the company this high-volume consumer application helps to underscore the broad applicability of Ziptronix’s patented technology beyond image sensors.

Microsemi Corporation has introduced the first in a new family of octal source driver integrated circuits for aerospace and other high-reliability power electronics control applications including motor control. The AAHS298B is radiation-tolerant to 100kRad (Si) total dose and has been screened to meet operating temperatures ranging from -55 to 125 degrees Celsius and class S and class B screening levels. The new driver can be used in conjunction with Microsemi"s radiation-hardened and -tolerant programmable logic products and diodes to easily implement redundant power management solutions.

Microsemi Corporation has announced the availability of new advanced motor control algorithms optimised for its SmartFusion customisable system-on-chip (cSoC), allowing design engineers to develop highly reliable multi-motor control in a single IC and reducing system cost and power. The new solution is suited for safety-critical applications in industrial, avionics, defense and medical markets.

Toshiba Electronics Europe has expanded its family of ultra-low power stereo headphone amplifier ICs with a new class-G device that combines audio with a digital I2S interface. The TC94B15WBG has been designed for mobile phones, MP3 players, Bluetooth headsets, portable navigation equipment and other battery-powered devices requiring efficient, high-quality audio amplification.

Samsung Electronics has announced that it has begun sampling the industry"s first 16-gigabyte (GB) double data rate-4 (DDR4), registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems. Using 30nm-class process technology, Samsung sampled new 8GB and 16GB DDR4 modules last month, in addition to providing them to major CPU and controller makers.

Atmel Corporation has announced production availability of a low-frequency (LF) RFID transponder device, the ATA5577M1330C-PP. Designed for applications in building access control systems, industrial automation, consumer and industrial segments, and as tokens, key fobs or transponders, this new device offers designers the ability to develop more flexible, high-performance tag devices.