ICs & Semiconductors

Dialog Semiconductor, a provider of highly integrated innovative power management, audio and short range wireless technologies, has announced its single-chip system power management ICs (PMICs) are being used to optimise the power requirements of tablets, infotainment systems, media hubs and other smart devices based on Freescale multicore i.MX 6 series applications processors.

ARM and Cadence Design Systems have announced the availability of the first in a series of combined solutions enabling designers to improve performance, power and time-to-market for ARM Cortex-A series processor-based system-on-chips (SoCs). The initial solution optimises ARM POP intellectual property (IP) technology, using the Cadence Encounter digital platform, for the Cortex-A9 processor on the TSMC 40LP process, including ultra low threshold voltage (uLVT).

Samsung Electronics has begun volume production of an ultra-fast embedded memory for smartphones, tablets and other mobile devices in 16-, 32- and 64-gigabyte (GB) densities. The new Samsung eMMC (embedded multimedia card) Pro Class 1500 delivers what is believed to be the industry's fastest speeds for an embedded memory device...

Microchip has announced the expansion of its stand-alone Real-Time Clock/Calendar (RTCC) portfolio with the new 10-pin, SPI MCP795XX family.  These new devices offer many of the same features as the larger 14-pin MCP795WXX family, including an enhanced timekeeping performance.

Future Technology Devices International Limited (FTDI) continues to work to encourage the progression of the Android Open Accessories initiative, with the introduction of its FT311D. This new USB Full Speed (12 Mbit/s) host IC is specifically targeted at providing Android platforms with interconnectivity to end product systems through the utilization of USB technology.

The LSI Corporation has unveiled a host of enhanced features for its SandForce SF-2200/2100 Client Flash Storage Processors (FSPs) which are specifically designed to satisfy the stringent power consumption requirements of Ultrabooks while at the same time providing improved performance benefits from its flash-based technology.

Lattice Semiconductor has released a serial sub-LVDS bridge design to support Sony’S IMX136 and IMX104 image sensors.  The serial sub-LVDS format is expected to become Sony’s primary image sensor interface for embedded/industrial users. 

Wireless applications will prove to be the saving grace of the global semiconductor market in 2012 in light of the category’s strong double-digit revenue growth, compared too much lower expansions or even losses in most other major market segments.

HiWave Technologies, a developer of audio amplifier ICs, full frequency range speaker drivers and next generation haptic touch devices, has launched the Farina platform that through a combination of bending wave transducer and electronics is set to  revolutionise the way audio signals are delivered to the listener. When mounted onto the frames of spectacles, such as those used for 3D gaming, the Farina transducer stimulates the outer ear, or pinna, with a broadband audio signal, turning the spectacles into headsets.

Texas Instruments (TI) reinforced its lead in the fast-growing industrial electronics semiconductor market last year, with the company’s purchase of National Semiconductor boosting its market share, according to a new report from IHS iSuppli . Already the market leader in 2010, TI further enhanced its market dominance in 2011 as its revenue from the industrial electronics chip space grew to $2.2 billion, up 24.9 percent from $1.8 billion a year earlier. TI’s market share last year now stands at 7.3 percent, up from 6.4 percent in 2010.