ICs & Semiconductors

INEMO smart sensor aids real-time body-motion reconstruction

STMicroelectronics has developed a smart suit prototype with sewn-in new multi-sensor iNEMO motion co-processor that can recognise complex body movements and translate them to a digital model with precision and speed. The iBMR, iNEMO Body Motion Reconstruction technology could improve outcomes in clinical and sports medicine applications, as well as enhance augmented reality where users could, for example, jog side by side with the world champion on their local running track.

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Renesas launches compact reference board for STB solution

Renesas Electronics has announced the development of an ultra-compact reference board that can be used as an IP network–compatible High Definition set-top box (STB) solution. The new reference board adds cloud features to non connected TVs, enabling multi-room content distribution (home content distribution), both of which are expected to achieve wide adoption in the near future.

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New audio amplifiers from STMicroelectronics

STMicroelectronics has introduced a high-performance, analogue class-D audio amplifier with best-in-class power density that will allow equipment manufacturers to combine superior audio quality with a small form factor in next-generation home and professional sound systems and active-speaker applications.

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Microchip expands XLP PIC MCU portfolio

Microchip is expanding its eXtreme Low Power (XLP) microcontrollers (MCUs) with the introduction of the PIC24F ‘GA3’ family, which features a low active current for 16-bit Flash MCUs, as well as several flexible new low-power sleep modes. The devices feature 150 microamperes/MHz active current, as well as six DMA channels, which allow a routine to be executed with less power consumption and increased throughput.

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CES – Lattice combines with Aptina to provide dual image sensor stereo camera design

Lattice Semiconductor, in collaboration with Aptina, has announced that it will be demonstrating a low cost, dual image sensor design at this week’s Consumer Electronics Show (CES) in Las Vegas. The dual image sensor design utilizes two Aptina MT9M024/MT9M034, 720P image sensors and combines the image into a single bus on which an ISP (Image Signal Processor) can operate.

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Toshiba launches SLC NAND flash memory with embedded ECC

Toshiba Electronics Europe (TEE) has announced the development of BENAND, a versatile, multi-application single level cell (SLC) NAND flash memory with an embedded error correction code (ECC). BENAND’s diverse applications include LCD TVs and digital cameras along with robots and other industrial applications.

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Maxim unveils highly integrated family of SoCs for consumer applications

Maxim Integrated Products has announced the TINI family of highly integrated SoCs and codecs for consumer applications. Offering greater functional integration, TINI products have been designed to enable system designers to free board space for new differentiating features in smartphones, tablet PCs, smart TVs, and home-monitoring cameras.

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STMicroelectronics unveils dual-core gyroscope

STMicroelectronics has introduced what it claims is the market’s first dual-core gyroscope capable of handling both user-motion recognition and camera image stabilization. The new device means that equipment manufacturers only need a single gyroscope for the two different functions, reducing the size, system complexity, and cost in mobile phones, tablets, and other smart consumer devices.

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Semiconductor suppliers adjust to slow market conditions

Chip inventories held by semiconductor suppliers declined in the third quarter of 2011, putting a halt to the steady expansion of the previous seven quarters, as the industry cut production in order to reduce oversupply. As calculated by the days of inventory (DOI) measure, semiconductor stockpiles in the third quarter stood at 81 days, down a modest 2.5 percent from 83 days in the second quarter, according to new research from IHS iSuppli.

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New programmable imaging and vision platform for camera-enabled devices

CEVA, a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores has announced the availability of the first imaging and vision platform based on its CEVA-MM3000 architecture framework. The CEVA-MM3101 is a fully programmable, low power platform developed to meet the advanced image and vision processing use-cases in camera-enabled devices, including smartphones, tablets and smart TVs.

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