ICs & Semiconductors

Fujitsu Semiconductor Europe (FSEU) has expanded its scalable line-up for automotive instrument clusters, covering everything from MCUs for traditional clusters up to 3D graphic systems on chips (SoC), as well as being capable of driving virtual or free programmable clusters. The newest member, the MB9DF125, nicknamed "Atlas-L", is based on the well-established ARM Cortex-R4 core and includes a Secure Hardware Extension (SHE) module offering customers secure high-performance operation. The SHE block is fully hardware-implemented to ensure the highest levels of security.

ON Semiconductor has collaborated with Teledyne Imaging Sensors to manufacture an Extremely Large Stitched Read Out Integrated Circuit (ELS ROIC) for astronomy. The H4RG-15 image sensor, designed by Teledyne, is the latest generation of a 20-year effort sponsored by the National Science Foundation, the National Aeronautics and Space Administration, and Teledyne internal funding to develop increasingly larger and more powerful infrared sensors for astronomical research.

Following on from the announcement of its XTRM products family (-60°C to +230°C) of high-temperature and extreme reliability electronics components, X-REL is making available a new set of products belonging to its diode family. The XTR1N0415 / XTR1N0450 are diodes with a reverse voltage above 55V while the XTR1N0815 / XTR1N0850 are diodes with a reverse voltage above 90V.

Toshiba Electronics Europe (TEE) has introduced the T4K37, a 13 mega pixel, 1.12 micrometre, CMOS image sensor that is capable of delivering high-image quality equivalent to a 1.4 micrometre pixel image sensor. Toshiba implemented back side illumination (BSI) technology and integrated colour noise reduction (CNR) to develop this CMOS image sensor which can fit into an 8.5mm x 8.5mm size camera module and that can provide high-quality pictures even in low-light conditions.

Renesas Electronics has launched the R-IN32M3 series of industrial Ethernet communication chips with support for multiple communication protocols in a move the company describes as being in response to the rapid adoption of industrial Ethernet communication technology.

Toshiba Electronics Europe (TEE) has revealed a new security module for automotive microcontrollers, which meets advanced industry standards aimed at protecting vehicle electronics against hacking, tampering and software IP theft. The Toshiba Security Module (TSM) was developed at the company’s European Automotive LSI Development Centre (ELDEC) in Düsseldorf, and will be built into future generations of the company’s automotive microcontrollers.

Texas Instruments (TI) has introduced a high-temperature, non-volatile Flash memory device for harsh environments. The SM28VLT32-HT has an operational capacity of 4 MB and eliminates the need for costly up-screening and qualification testing of industrial-grade components for temperature ranges outside data sheet specifications.

Samsung Electronics has launched a next-generation 64GB embedded multimedia card (eMMC) that uses 10 nanometer (nm)-class process technology. The 64Gb NAND memory went into production late last month. Embedded memory is the key memory component in mobile applications and advanced high-performance, high-density eMMCs will allow users to access HD video on their latest mobile devices and provide a better user experience for web browsing, gaming and running rich applications.

Designed for smart, connected embedded electronics for applications such as utility metering and renewable energy, STMicroelectronics has unveiled the STM32 F427 and F437 microcontrollers extending its STM32 F4 portfolio.

Microcontroller (MCU) and touch technology company, Atmel, has become the newest member of the G3-PLC Alliance, an international organisation set up to promote the G3-PLC Communications standard that ensures interoperability across new smart grid ecosystems. Members are selected and approved by the G3-PLC committee.