ICs & Semiconductors

Toshiba expands high-performance memory card family with first microSD EXCERIA products

Toshiba Corporation has announced that it will expand its family of EXCERIA memory cards with new microSD versions. EXCERIA (derived from a combination of “excellent” and “experience”) offers cards compliant with the UHS-I Memory Card Standard. The minimum recording speed is compliant with UHS speed class 1 and SD speed class 10.

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HD format FSI image sensors round out Toshiba’s product portfolio

Toshiba Electronics Europe (TEE) has announced the addition of two new devices to its metal oxide semiconductor (CMOS) image sensor product offering. The T4K08 is a new native HD format sensor (720p) combining 1.75µm front side illumination (FSI) pixel technology and System on Chip (SoC) Image Signal Processing (ISP) and the T4K24 is a new FSI image sensor also leveraging 1.75µm FSI pixel technology and providing a resolution of 1080p.

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Fujitsu releases wide-voltage and low-power 8-bit MCUs with LCD control and analogue functionality

Fujitsu Semiconductor Europe (FSEU) is expanding its "New 8FX" family of high-performance 8-bit microcontrollers to include twelve products each from the 64-pin MB95770 series and the 80-pin MB95710 series, both of which feature LCD control and advanced analogue functionality. The MCUs support a wide range of operating voltages from 1.8V to 5.5V.

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MCU delivers ‘best-in-class’ temperature sensing accuracy, according to Silicon Laboratories

The latest family of high-performance 8-bit microcontrollers (MCUs) from Silicon Laboratories feature the company’s latest mixed-signal breakthrough, an integrated temperature sensor with best-in-class accuracy over an extended temperature range and without the need for calibration. Offering a mix of integrated high-performance analogue peripherals and a very fast 8051 CPU in a compact package, the C8051F39x/7x MCU family provides a solution for optical transceiver modules, sensor interfaces and brushless dc motor applications for fans, dryers, vacuum cleaners and remote control toy vehicles.

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Jabra adopts Dialog’s short range wireless audio ICs

Dialog Semiconductor, a supplier of highly integrated power management, audio and short range wireless technologies, has announced that Jabra has adopted the company"s short-range wireless audio ICs to create the Jabra PRO 9450 Flex JP headset, which connects with office phones and PCs running VoIP calling software, such as Skype or Microsoft Lync.

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Cost-competitive 5-megapixel CameraChip sensor from OmniVision

OmniVision Technologies, a developer of advanced digital imaging solutions, has launched the OV5648, a high-performance, low-cost 5-megapixel CameraChip sensor for smartphones and tablets. Using the latest 1.4-micron OmniBSI+ pixel architecture, the OV5648 is a technology upgrade of the OV5647. The new sensor combines a smaller die size with higher quality photography and high definition (HD) video, making it suitable for mainstream mobile applications.

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NXP releases new Class-D Amplifier boosting power output and efficiency

NXP Semiconductors has unveiled the TDF8599C, a new automotive stereo Class-D amplifier which targets sound systems in premium cars where high power output and efficiency are required. The device offers a supply voltage range up to 48V that enables extremely high output power and the flexibility for sound designers to drive high-ohmic load speakers.

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STMicroelectronics and FAW Group look to drive innovation in automotive electronics

STMicroelectronics, in co-operation with the China FAW Group Corporation (FAW), has announced the establishment of a joint laboratory in the FAW Group Research and Development Center that will focus on advanced research covering comprehensive cutting-edge solutions in power train, chassis, safety, car body, car infotainment, and new-energy technologies, as well as other automotive applications.

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New packaging technology enables miniaturised implantable medical devices

Microsemi Corporation has developed new die packaging technology that has passed an internal qualification regime typical for active implantable medical devices consisting of thermal and mechanical stressing to MIL-STD-883 test standards. The die packaging technology is targeted at implantable medical devices such as pacemakers and cardiac defibrillators but can also be used in wearable devices such hearing aids and intelligent patches, as well as nerve stimulators and drug delivery products.

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European and Japanese chip suppliers hit hard by weak market growth in Q2

Held back by poor economic conditions, global semiconductor market revenue in the second quarter fell by 3 percent year-on-year, resulting in widespread revenue declines for chip suppliers, particularly those headquartered in Japan and Europe. Worldwide semiconductor sales decreased to $75.2 billion in the second quarter of 2012, down from $77.5 billion during the same period in 2011, according to new market research analysis from IHS iSuppli.

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