NXP Semiconductors and TSMC today announced a collaboration agreement to adopt TSMC’s 5-nanometer (5nm) technology for NXP’s next generation, high-performance automotive platform. This collaboration combines NXP’s automotive design expertise with TSMC’s industry-leading 5nm technology to further drive the transformation of automobiles into powerful computing systems for the road. Building upon …
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Agile Analog, a leading provider of semiconductor analog IP, today announced Palma Ceia SemiDesign, a provider of communication chips and IP for WiFi HaLow and Cellular NB-IoT applications, has selected Agile Analog’s data converter and power management IP for its next-generation of WiFi and cellular IoT products. Agile Analog’s innovative …
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Analog Devices, Inc. has announced the successful closing of the first green bond offering in the semiconductor industry. The company’s green bond issuance consisted of $400 million aggregate principal amount of 2.950% senior unsecured notes due April 2025. “At ADI, we are committed to engineering a sustainable future and this …
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Anglia is now offering an expanded range of discrete semiconductors after signing a distribution agreement covering the UK and Ireland with Panjit International Inc, a leading supplier. Panjit complements Anglia’s extensive line up of discrete semiconductors with additional rectifier, Zener, circuit protection, MOSFET and transistor devices. Anglia has put a …
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CISSOID, the leader in high temperature semiconductors for the most demanding markets, announces today a new 3-Phase SiC MOSFET Intelligent Power Module (IPM) platform for E-mobility. This new IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers. Co-optimizing the electrical, mechanical and …
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Dialog Semiconductor plc, a provider of power management, charging, AC/DC power conversion, Wi-Fi and Bluetooth low energy technology, has announced the latest member of its IO-Link product family, the CCE4503. The addition of this new IO-Link IC both expands the company’s reach into the Industrial IoT (IIoT) market and connects the …
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The so-called miniature cooling aggregates are very efficient and reasonable to use for dissipating heat in larger amounts in smallest space. The combination of a fin structure, optimised in terms of flow technology, in connection with powerful fans leads to a significantly greater heat dissipation per volume unit than natural …
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Toshiba Electronics Europe has launched a range of general-purpose system power ICs with multiple-outputs. The new devices support functional safety according to ISO26262 for safety-critical automotive applications including those that require extremely high safety such as electric power steering systems (EPS) and braking systems where ASIL-D is required. The series …
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RIBER, a global market leader for semiconductor industry equipment, announces a major order for more than one million euros from a customer in Asia for the supply of accessories and spare parts in the OLED display industry. This order, deliverable in 2020, follows the evaporators sales recorded in 2017 and …
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XP Power has announced the launch of a new 30 Watt DC-DC power module that can generate up to 6kVDC from a single 24VDC input. The HRL30 series provides an accurate high voltage output for a wide variety of applications, including scientific and semiconductor uses. With 22 voltage models in …
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CIE Components in Electronics