Weebit Nano, a developer of next-generation memory technologies for the global semiconductor industry, has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module in an advanced 22nm FD-SOI (fully depleted silicon on insulator) process technology. This is the first tape-out of Weebit ReRAM in 22nm, one …
Read More »
CML Microcircuits, developer of low-power analogue, digital and mixed-signal semiconductors for global telecommunications systems, has announced the availability of the CMX90G701 and CMX90G702 Positive Gain-Slope Amplifiers. Developed using CML’s SµRF MMIC design capability, these general-purpose gain blocks are ideally suited to a wide range of wireless applications operating in the …
Read More »
Search for the Next (SFN), developers of the Bizen wafer process, Zpolar transistor and Zpolar Tunnel Logic (ZTL), have announced the WaferTrain network of foundries that is equipped with the Bizen wafer process and with capacity available now to build ICs that are equivalent to 180nm CMOS devices, yet are …
Read More »
Melexis, a global microelectronics engineering company, has introduced a new series of integrated pressure sensors. They are intended for use in automotive engine management. The MLX90824 determines the absolute pressure, then delivers a digital output signal using the SENT protocol whereas the brother product MLX90822 provides an analog output voltage. …
Read More »
Power Integrations, a specialist in high-voltage integrated circuits (ICs) for energy-efficient power conversion, has launched the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which are said to substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride primary switch and steady-state switching …
Read More »
Power Integrations, the specialist in high-voltage integrated circuits (ICs) for energy-efficient power conversion, has announced the InnoSwitch™4-Pro family of digitally controllable, off-line CV/CC Zero Voltage Switching (ZVS) flyback ICs, which substantially reduce the size of power adapters. Incorporating a robust PowiGaN gallium-nitride primary switch and steady-state switching frequency of up …
Read More »
Cambridge GaN Devices (CGD), the fabless semiconductor company that was spun out of the renowned power device group at the Engineering Department of the University of Cambridge in 2016, has raised $19m in Series B funding. The investment was led by Parkwalk Advisors and BGF, with participation from IQ Capital, …
Read More »
SOLiD, a global leader in cellular in-building mobile coverage, has selected Picocom silicon and software to power its next generation of 5G Open RAN Radio Units (O-RUs). Picocom is a semiconductor company that designs and markets open RAN standard-compliant baseband SoCs and carrier-grade software products for 5G small cell infrastructure. …
Read More »
EASii IC has announced its satellite modem ASIC, EZID211 also known as Oxford-2. The Oxford-2 is aimed at the earth-segment satellite communication market. Targeted applications include: internet via satellite user terminals covering GEO, MEO and LEO constellations, aero-mobile, earth observation, cellular backhaul, IP trunking, IOT and many other applications. The …
Read More »
Renesas Electronics, a supplier of advanced semiconductor solutions, has unveiled an automotive power management IC (PMIC) for next-generation automotive camera applications. The RAA271082 is a versatile ISO-26262 compliant multi-rail power IC with a primary high voltage synchronous buck regulator, two secondary low voltage synchronous buck regulators, and a low voltage …
Read More »
CIE Components in Electronics