ICs & Semiconductors

FTDI Chip launches sophisticated USB 3.0 interface solution

The FT600Q and FT601Q are FTDI Chip’s first generation USB 3.0 products that function as SuperSpeed USB 3.0 to FIFO bridges, providing data bursting rates of up to 3.2Gbps. The FT600Q comes in 56-pin QFN package and has a 16-bit wide FIFO bus interface, while FT601Q comes in 76-pin QFN package and has a 32-bit wide FIFO bus interface. Both chips support up to 8 endpoints, other than the management endpoints. The endpoints are linked to a configurable endpoint buffers of 16kByte length for IN and 16kByte for OUT.

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Toshiba expands image recognition processors line-up

Toshiba Electronics Europe has expanded its line-up of image recognition processors with the launch of the TMPV760 series. Supported by 14 hardware-based image recognition accelerators, the first device in this new series will support the implementation of next generation Advanced Driver Assistance Systems (ADASs). The TMPV7608XBG supports standard ADAS features such as AEB (Autonomous Emergency Braking), TSR (Traffic Sign Recognition), LDW (Lane Departure Warning) / LKA (Lane Keeping Assist), HBA (High Beam Assistance), FCW (Forward Collision Warning).

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Second generation MEMS accelerometer and gyroscope suits automotive and industrial applications

Murata has introduced the SCC2000 series of combined accelerometer and gyroscope sensor devices aimed at use in tough environments such as those encountered in automotive and industrial applications. The series has best in class temperature dependency, shock sensitivity and bias stability characteristics and consists of a low-g 3-axis accelerometer with two angular rate sensor options of either X or Z-axis detection, together with a 32-bit digital SPI interface.

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Advanced optical sensor family integrates touchless gesture detection and e-commerce functionality

ams AG has released a new family of intelligent sensors that integrate six key sensing functions including gesture detection and Mobeam barcode emulation. The TMG399x product family is suited for touchless gesture control and display management in smartphones, tablets and many other consumer electronics on the market today.

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STMicroelectronics launches automotive audio processor

STMicroelectronics has introduced a new generation of processors for Car-Radio and Display-Audio applications. Building on the success of the popular STA1052 audio System-on-Chip, the new Accordo2 family (STA1095 and variations) offers an unprecedented level of hardware and software integration, thereby enabling the industry’s fastest time-to-market solutions at the greatest value.

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Renesas Electronics Europe announces PROFINET solution kit

Renesas Electronics Europe is making available the “Connect it! - TPS-1 Solution Kit”, a complete evaluation tool for the TPS-1PROFINET isochronous real time (IRT) device chip. The new kit includes all the hardware, software and demonstration programs customers need to start their own developments on a PROFINET network.The kit has been developed to facilitate integration for customers developing solutions for Europe’s dominant industrial Ethernet market and helps them get their products to market faster.

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New contactless position sensor from ams

The AS5601 is a new contactless rotary position sensor from ams AG and has been designed to give designers an extremely reliable replacement for conventional rotary encoders, while providing a software-compatible incremental quadrature output. In devices which use rotary knobs, the AS5601 and its paired magnet may replace a rotary encoder without any change to the host microcontroller or its application software.

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Analog Devices looks to improve signal measurement sensitivity in low-power applications

Analog Devices has released a new synchronous demodulator. The ADA2200 uses ADI’s patent pending sampled analogue technology (SAT), developed at Lyric Semiconductor, which was acquired by ADI in mid-2011, and incorporates a configurable analogue filter to enable designers of portable and low-power instrumentation to maximize battery life and perform precision magnitude and phase measurements on analogue signals in the presence of large noise sources.

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Imec researchers using Coventor’s SEMulator3D platform to model 7nm manufacturing technology

Belgian nanoelectronics research centre imec has announced a joint development project with Coventor, a supplier of semiconductor process development tools. The collaboration will enable faster and more optimised development of advanced manufacturing technology in the 3D device architecture era, extending down to imec’s 10- and 7-nanometer (nm) processes.

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Automotive infotainment companion chip supports multimedia connectivity and camera devices

Toshiba Electronics Europe (TEE) has made a key addition to its extensive portfolio of solutions for the automotive market. The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.

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