ICs & Semiconductors

Sivers Semiconductors to acquire MixComm, a US mmWave challenger

Sivers Semiconductors has entered into an agreement to acquire 100 per cent of the share capital of MixComm, a US-based mmWave challenger fabless semiconductor company, for an initial purchase price of USD 135m on a debt-free basis. Following completion, the enlarged Sivers group will be a global leader in 5G …

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Inseto invests in wedge bonder and launches two training courses

Inseto, a technical distributor of equipment and materials, has invested in a Kulicke & Soffa (K&S) Asterion wedge bonder. Located in Inseto’s Process Development Laboratory along with materials test and plasma cleaning equipment, the automatic bonder is suitable for the large-wire, fine-wire and ribbon bonding of hybrid circuits, semiconductor devices, …

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High-precision voltage reference IC provides very-low drift for extended-temperature automotive applications

Extended-temperature-range voltage reference ICs for automotive and industrial applications require low drift, high reliability and high performance. Microchip Technology has released a high-precision voltage reference (Vref) IC that meets these needs at a cost-effective price. The new MCP1502 is an AEC-Q100 Grade 1 (-40°C to +125°C operating temperature range) automotive-qualified …

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1.5kW constant voltage and constant current power supply offers advanced programmability

XP Power has announced two new single phase 1.5kW AC-DC power supplies that offer programmable constant voltage (CV) and constant current (CC) operation with analogue and digital interfaces for user control. The compact and convenient solutions use an efficient resonant zero-volt switching (ZVS) topology and are suitable for equipment manufacturers …

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Lattice Semiconductor – Accelerating automation

By Eric van der Heijden, Vice President of Sales, EMEA, at Lattice Semiconductor Globally, smart factories are now leveraging advanced automation applications such as augmented reality, autonomous mobile robots, cobots, and industrial sensors. Even beyond the traditional factory floor, automation is accelerating in areas like warehouse automation and logistics using …

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The Linley Group – CertusPro-NX Reinvigorates General-Purpose FPGAs

By Aakash Jani, Senior Analyst, The Linley Group CertusPro-NX, the fourth product developed using Lattice Semiconductor’s Nexus platform in the last 18 months, delivers class-leading power, performance, and size for diverse applications. These general-purpose FPGAs offer low power, small packages, and high-bandwidth I/Os, such as PCIe Gen3 and Gigabit Ethernet. …

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Sivers Semiconductors launches 5G NR mmWave RFICs and high-powered RF modules

Sivers Semiconductors has launched the new highly integrated 5G NR Radio Frequency Integrated Circuits (RFICs), TRB02801 and TRB03901, together with very high-powered RFIC and antenna RF modules, BFM02801 and BFM03901, covering all licensed 5G mmWave bands. These RFICs (TRB02801and TRB03901) support the full frequency range from 24.25 to 43.5 GHz …

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Equipment partners of IES combine their photonics expertise at SPIE Photonex + Vacuum Technologies 2021

IES, a partner of R&D and semiconductor equipment specialists, will be attending SPIE Photonex + Vacuum Technologies 2021 to discuss processing equipment for photonics applications. IES represent a selection of equipment manufacturers, including EV Group (EVG) and scia Systems (scia). EVG, a supplier of wafer bonding and lithography equipment, recently …

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UnitedSiC announces 6mohm SiC FET

UnitedSiC, a manufacturer of silicon carbide (SiC) power semiconductors, has responded to the power designer’s requests for higher-performance, higher-efficient SiC FETs with the 750V, 6mohm device. At a RDS(on) value of less than half the nearest SiC MOSFET competitor, according to UnitedSiC, the new 6mohm device also provides a robust …

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X-FAB to offer high-volume micro-transfer printing capabilities

X-FAB Silicon Foundries, the foundry for analog/mixed-signal and specialty semiconductor solutions, is now able to support volume heterogeneous integration via Micro-Transfer Printing (MTP), thanks to a licensing agreement that has just been secured with X-Celeprint. This will mean that a diverse range of semiconductor technologies may be combined together, each …

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