Embedded

Imperas models for arm processors now available in TESSY by Razorcat

Imperas Software, a specialist in virtual platforms and high-performance software simulation, has announced that Razorcat Developments, a provider of software testing tools for the embedded systems market, has integrated the Imperas fast processor reference models into the TESSY environment for embedded software testing. Embedded software development requires rigorous testing not …

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MIKROE adds supports for NXP Kinesis MCUs to ‘universal’ mikroSDK software development kit

MikroElektronika (MIKROE), the embedded solutions company that cuts development time by providing hardware and software products based on proven standards, has announced that its multi-architectural software development kit, mikroSDK 2.0, now supports 147 MCUs from leading embedded IC maker, NXP. mikroSDK is a collection of open-source software libraries with unified …

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Wide 85-305VAC input AC-DC power supplies for embedded applications from 15W to 320W

XP Power has introduced the LCW series of regulated output cased AC-DC power supplies that is suitable for embedded industrial electronics, technology and equipment requiring household approvals. The nine new series (LCW15, LCW25, LCW35, LCW50, LCW75, LCW100, LCW150, LCW200 and LCW320) offer power levels from 15W to 320W. All models …

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MIKROE introduces $79 LTE IoT 8 Click board for wearables, asset tracking, monitoring and metering

MikroElektronika, the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched LTE IOT 8 Click – a member of its 1000-strong Click family of peripheral development boards – targeting designers of low-power LTE-M and NB-IoT connectivity solutions in …

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Rollout of windshield breakage detection IoT device

MUNIC, the specialist in artificial intelligence and embedded technologies for the automotive and fleet sectors, today announced that Jack, developer of the first windshield breakage detection solution has selected the Munic.io solution to support Jack’s rollout in the United States and Europe. The Jack windshield-mounted device detects windshield impacts, analyzes …

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eSOL eMCOS® Hypervisor nominated for Embedded Solution Product of the Year

eSOL, a leading global developer of real-time embedded software solutions, has been nominated in the ‘Embedded Solution Product of the Year’ category at The Electronics Industry Awards 2021 for its eMCOS Hypervisor platform solution.    Developed in Europe, eMCOS Hypervisor is a truly ground-breaking embedded virtualisation function that opens up even greater …

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MIKROE’s universal FUSION development board for all Microchip PIC microcontrollers ‘equipped with everything developers need’

MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched FUSION for PIC v8, offering universal support for PIC, dsPIC, PIC24, PIC32 microcontrollers on one board. FUSION development boards are ideal for rapid prototyping and are …

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Shock and vibration resistant

congatec – a leading vendor of embedded and edge computing technology – introduces new 11th Gen Intel Core processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full …

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SEGGER and Analog Devices Collaboration Delivers Communication Solution for Industrial Ethernet-APL

SEGGER Microcontroller GmbH, a leading provider of development tools and software for embedded systems,  announced a collaboration with Analog Devices, Inc., a leading global high-performance semiconductor company that provides embedded engineers with a new solution for the development of industrial Ethernet applications including the new Ethernet-APL standard. The collaboration between …

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Winbond HyperRAM & SpiStack and Renesas RZ/A2M accelerate the construction of embedded artificial intelligence (AI) systems

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, announced today the official confirmation that its HyperRAM and SpiStack (NOR+NAND) can be operated with Renesas’ RZ/A2M Arm-based microprocessors (MPUs). Customers of the RZ/A2M can benefit from Winbond’s long-term supply for various types of external memory, including DRAM, NOR Flash, …

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