Embedded

DATA MODUL presents a 21.5-inch high-brightness display for the extended temperature range

DATA MODUL, one of the world’s leaders in display, touch, embedded, monitor and panel PC solutions, is expanding its display portfolio and presents the first industrial 21.5-inch high-brightness display for the extended temperature range. As a semi-outdoor display, it is ideal for digital signage, vending machines and HMI applications in …

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Lattice Expands mVision Solutions Stack Capabilities

Lattice Semiconductor Corporation, the low power programmable leader, launched the latest version of its award-winning solutions stack for low power embedded vision systems, Lattice mVision™ 2.0. The new version features multiple updates that further accelerate the design of embedded vision applications for industrial, automotive, medical, and smart consumer systems. It …

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Extended temperature range platforms for edge computing – from high-end COM-HPC to low power SMARC

congatec – a leading vendor of embedded and edge computing technology – focuses on customers’ ruggedization challenges at virtual embedded world 2021, presenting extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The solution portfolio for COM-HPC server modules is particularly impressive, tackling …

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PCAP support tool easyANALYZER 4.11 now available for new controller series and firmware versions

DATA MODUL, one of the world’s leaders in display, touch, embedded, monitor and panel PC solutions, presents the easyANALYZER 4.11 which is the latest version of the company’s own PCAP support and tuning tool. The easyANALYZER helps users define, align and change the settings and parameters of their touch displays …

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Real-time operation over broadband

congatec – a leading vendor of embedded and edge computing technology – introduces new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking (TSN) in combination with the new Intel Time Coordinated Computing (Intel TCC) technology, which complements the …

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Important milestone for the COM-HPC integration

congatec – a leading vendor of embedded and edge computing technology – introduces the first carrier board and cooling solutions building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are a major milestone for the COM-HPC integration and have been created to accelerate the …

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Massively more power on much smaller footprint

congatec – a leading vendor of embedded and edge computing technology – significantly broadens the application areas of its AMD Ryzen Embedded processor based COM Express Type 6 platforms towards smaller but more powerful system designs by premiering the brand new AMD Ryzen Embedded V2000 processor launched today on the …

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New state-of-the-art Computer-on-Modules

congatec – a leading vendor of embedded and edge computing technologies – announces launch of 12 brand new Computer-on-Modules in parallel with today’s Intel IOTG (Internet of Things Group) launch of the 11th Gen Intel Core processors. Based on the new low-power high-density Tiger Lake SoCs the new modules offer …

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congatec presents Intel IoT RFP Kit for workload consolidation in vision based situational awareness applications

congatec – a leading vendor of embedded computing technology – presents its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel Xeon E2 processor, the …

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Application-ready congatec COM/carrier combo

congatec – a leading vendor of embedded computer technology – announces its brand new conga-SMC1/SMARC-x86 3.5-inch carrier board. The new size-optimised SMARC 2.1 carrier board in 3.5-inch form factor is application-ready and off-the-shelf deployable in small to mid sized series in combination with any congatec SMARC Computer-on-Module available to date. …

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