Components

Components bottleneck drives German components distribution forward

The shortage of components continues to drive great numbers for the distribution industry, according to FBDi e.V. – Fachverband der Bauelemente Distribution e.V. (Professional Association of Component Distribution) . Although the summer quarter did not bring new sales records, it clearly ended with record orders. Sales by distributor members of …

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SABIC introduces Superflow ULTEM resins to enable miniaturization for burn in test sockets (BiTS) and connectors powering electronic devices

SABIC, a global leader in the chemical industry, is introducing two new grades in its portfolio of Superflow ULTEM resins that address the trend of electronic component miniaturization to enable smaller, lighter and more sophisticated devices. Glass fibre-reinforced Superflow ULTEM SF2250EPR and SF2270 resins feature impressive flow properties for molding …

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Efinix Selects Winbond HyperRAMTM for its Ti60 F100 Platform to Drive a New Generation of Compact, Ultra-Low Power AI and IoT Devices

Winbond’s 256Mb HyperRAM 2.0e KGD (Known Good Die) provides the Efinixâ Titanium Ti60 F100 FPGA with the performance, low power consumption and small size needed for embedded AI applications at the edge Requiring only 22 signal pins versus the standard 31-38 needed by legacy DRAM, Winbond’s HyperRAM 2.0e KGD enables …

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PCI Express 3.0 Packet Switch from Diodes Incorporated Offers Design Flexibility and Advanced Power Management

Plano, Texas – October 20, 2021 – Diodes Incorporated (Nasdaq: DIOD) has announced the PI7C9X3G816GP, a PCIe® 3.0 packet switch that supports 16-lane operation in flexible 2-port, 3-port, 4-port, 5-port, and 8-port configurations. Designed to meet advanced performance needs, this switch is well-suited for networking and telecommunications infrastructure, security systems, …

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