Automotive

Nexperia, the expert in essential semiconductors, has added to its rapidly expanding portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and automotive applications. The latest additions include 32 planar Schottky diodes and eight hyperfast recovery rectifiers housed in the CFP15B package. They are available as standard and Q-types that …

KDPOF, a supplier for gigabit connectivity over fiber optics, has introduced what it describes as “the first automotive Ethernet switch EVB9351-AUT-SW-NXP with five 1000BASE-RH optical ports, each comprised of KDPOF’s KD9351 FOT and KD1053 PHY IC”. “We very much appreciate the support from NXP Semiconductors, a world leader in secure …

Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, has received the ISO/SAE 21434 certification from TÜV NORD for Road vehicles Cybersecurity Management System (CSMS), making them the world’s first memory vendor to receive the ISO/SAE 21434 standard certification for Road vehicles Cybersecurity Management System (CSMS). ISO/SAE 21434 standard …

The RECOM RPX DC/DC converters in QFN housings are now also available as ‘-Q’ variants which meet the strict requirements of the automotive industry according to AEC-Q100 Grade 1. Optionally, they can also be equipped with ‘wettable flanks’ for automated optical inspection (AOI). The extremely small, lead-free, and thermally optimized …

Developed in accordance with the demanding IATF 16949 automotive quality standard EAO’s latest compact two- and six-pushbutton Series 09 keypads feature a modular design ideal for reliable and safe E1 operation in heavy duty in-cabin vehicular applications. The new modular Series 09 keypads feature impressive application-specific configuration options for both …

NXP Semiconductors has announced the NCJ37x Secure Element (SE), an automotive-qualified secure microcontroller with advanced cryptographic accelerators and physical built in electrical attack resistance for various security-critical automotive applications such as smart access key fobs, Qi 1.3 authentication or car-to-cloud communication. The device supports the protocols from the Car Connectivity …

TTI, Inc. – Europe, a specialty distributor of electronic components, will be exhibiting the latest technologies for fuel-cell and electric vehicles at the Cenex-Low Carbon Vehicle (LCV) event at UTAC in Millbrook, UK, on stand C4 619, 7th – 8th September 2022. Stand visitors will be able to learn about …

Diodes has made a further addition to its family of automotive-compliant DC-DC converters. The DIODES AP64060Q is a 600mA synchronous buck converter device with an input voltage range that covers 4.5V to 40V. It incorporates a 600mΩ high-side power MOSFET plus a 300mΩ low-side power MOSFET so that high-efficiency step-down …

Winbond’s new package 100BGA LPDDR4/4X has achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce …

NXP Semiconductors has signed a memorandum of understanding with Hon Hai Technology Group (“Foxconn”) to jointly develop platforms for a new generation of smart connected vehicles. Hon Hai (Foxconn), the world’s largest electronics manufacturer and a leading technology solution provider, will leverage NXP’s portfolio of automotive technologies and its longstanding …