Automotive

RTI joins NXP GoldVIP S32G Vehicle Integration Platform

Real-Time Innovations (RTI), the software framework company for autonomous systems, has announced that the RTI Connext Drive® automotive platform is now available through NXP Semiconductors’ GoldVIP program. NXP customers now have a direct way to access the technology to evaluate and test real-time data flows within and across their zonal …

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Weebit Nano ReRAM IP now available in SkyWater Technology’s S130 process

Weebit Nano Limited, a developer of advanced memory technologies for the global semiconductor industry, and SkyWater Technology, the technology realization partner, have announced availability of Weebit’s resistive RAM (ReRAM) IP in SkyWater’s 130nm CMOS (S130) process. SkyWater customers can now easily integrate Weebit’s proven non-volatile memory (NVM) in their system-on-chip …

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Data transfer via express: With microSD and SD card slots from Amphenol CS at Rutronik

Amphenol CS enables extremely fast data transfer rates of up to 985 MB / s with the SD Express and microSD Express card sockets. They support the PCIe Gen 3 interface as well as the NVMe application protocol. These connectors comply with SD 7.0 specifications, have a pin recognition function …

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Smart surface user experiences with aXiom

Supporting the next generation of automotive user interfaces and experiences, TouchNetix has announced its aXiom technology now supports smart surfaces. The aXiom user interface chip technology seamlessly and cost efficiently integrates underneath materials and fabrics. With, what is said to be, the market leading signal-to-noise ratio, aXiom facilitates features such …

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Low profile design combined with high moisture resistance: Vishay’s AEC-Q200 qualified DC link film capacitor at Rutronik

With the MKP1848Se low-profile DC-Link polypropylene film capacitor from Vishay Intertechnology, Rutronik’s portfolio includes a component that is the first of its kind to pass the THB (“Temperature Humidity Bias”) test at 60 °C / 93 % rel. humidity and nominal voltage for 56 days. AEC-Q200 qualified and designed for …

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LEM’s new current sensor for high-power EV traction inverters designed to deliver smallest footprint on the market

Distance and speed of charging are vital in the competitive EV sector and, like all vehicle components, high-power integrated traction inverters – which convert DC into AC and capture energy for the vehicle – need to combine superior performance with being as small and light as possible. Measuring just 29mm …

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Intelligent high-side switch from Diodes enables assured automotive system reliability

Diodes has introduced the DIODES ZXMS81045SPQ, its first protected, automotive-compliant, high-side IntelliFET. This device is capable of delivering high power from a small footprint, while also providing protection and diagnostic capabilities. It is suitable for driving 12V automotive loads, such as LEDs, bulbs, actuators, and motors in automotive body control …

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Spirent delivers flexibility for testing tomorrow’s Ethernet with compact M1 appliance

Spirent Communications, the provider of test and assurance solutions for next-generation devices and networks, has announced the availability of the compact M1 Appliance for testing Ethernet and Automotive Ethernet in tomorrow’s networks and applications. The new space-saving platform with its built-in flexibility is designed to help accelerate time to market …

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18.5-inch Full HD TFT display supports wide viewing angles

Display solutions and embedded systems provider Review Display Systems (RDS) has introduced a new 18.5-inch TFT display module from industrial display manufacturer Tianma. The P-series P1850FHF1MB01 features Full HD resolution (1920 x 1080 pixels), a wide 16:9 aspect ratio and in-plane switching (IPS) technology which provides excellent optical performance. Tianma …

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New N-channel power MOSFETs leverage advanced heat dissipation capabilities to support larger automotive currents

Toshiba Electronics Europe has launched two new automotive-grade 40V N-channel power MOSFETs that will have real impact on next-generation vehicle designs. The XPQR3004PB and XPQ1R004PB utilise the game-changing large transistor outline gull-wing leads package format – referred to as L-TOGL. Thanks to their L-TOGL packages, and the enhanced heat dissipation …

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