Automotive

u-blox and Geespace partner to extend Geely Group’s high precision positioning solutions in the USA and Europe

u-blox, a  global provider of positioning and wireless communication technologies and services, and Geespace, the provider of AICT (aerospace information and communications) infrastructure and application solutions, are announcing the signing of an MoU on the expansion of their respective augmentation services for high precision applications. Both partners will be able …

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Farnell introduces InfiniiVision 3000G X-series oscilloscope from Keysight

Farnell, an Avnet Company and global distributor of electronic components, products and solutions, has in stock availability of the new-to-market InfiniiVision 3000G X-Series Oscilloscope from Keysight. Available for fast shipping to Farnell’s global customer base, the 3000G X-Series Oscilloscope combines excellent usability with an enhanced toolset to diagnose elusive signal …

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New GPS/GNSS RTK modules expand LOCOSYS Technology’s line of high performance, cost-effective positioning modules for 5G, IoT and VX2 applications

Real-Time Kinematic (RTK) positioning modules use a technique that uses carrier-based ranging and provides positioning data that is more precise than that available through code-based positioning solutions. Since the launch of the world’s smallest RTK module (the LOCOSYS RTK-1010) last year, LOCOSYS Technology has continued to develop and expand new …

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Murata introduces metal power inductors for automotive applications up to 150 °C that set new benchmarks in ISAT and RDC

Now available from Murata is the DFE32CAH_R0 series of metal power inductors with high-temperature applications of up to 150 °C. Intended for use in DC/DC converters and power management circuitry for automotive applications, these components are supplied in 1210 inch size (3.2 mm × 2.5 mm) metal cores. Covering a …

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X-FAB upgrades its substrate coupling analysis tool to include BCD-on-SOI process

X-FAB Silicon Foundries SE, the analog/mixed-signal and specialty foundry, has expanded the scope of its SubstrateXtractor tool, via which unwanted substrate coupling effects can be examined. It is said to be the first foundry worldwide to offer this analysis function for a BCD-on-SOI process. With the company’s XT018 180 nm …

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New e-motor IP68 encapsulated precision RTD temperature sensor

The new IP68-rated Heraeus EC3032 Pt1000 temperature sensor assembly from ATC Semitec, is ideal for use in e-motor applications. With a temperature range of -50°C to +200°C (with a short-term rating of up to 250°C for 50 hours) it offers precise, and robust temperature sensing solution for harsh automotive environments. …

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Infineon CoolSiCTM MOSFET for 650V, 1200V, and 1700V at Rutronik

Infineon’s CoolSiC MOSFETs use an optimized, state-of-the-art trench semiconductor process that enables both the lowest losses in the application and the highest reliability in operation. The products, with voltage classes of 1700 V, 1200 V, and 650 V and forward resistances from 27 mΩ up to 1000 mΩ, are ideally …

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Small but powerful: 0,49” Micro OLED from Raystar at Rutronik

High contrast for small spaces: The REX006432A Micro OLED is Raystar’s solution for applications that can only fit a small OLED. Just like the larger products in the series, the OLED module has excellent functionality and a clean appearance. That makes it ideal for consumer and industrial applications such as …

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Microchip unveils 3.3 kV Silicon Carbide (SiC) power devices enabling new levels of efficiency and reliability

System designers of traction power units (TPUs), auxiliary power units (APUs), solid-state transformers (SSTs), industrial motor drives and energy infrastructure solutions require high-voltage switching technology to increase efficiency, reduce system size and weight and enhance reliability. Microchip Technology has expanded its SiC portfolio with the release of, what it describes …

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NXP and Hitachi Energy collaborate on power module to accelerate silicon carbide adoption in e-mobility

NXP Semiconductors are collaborating with Hitachi Energy to accelerate the adoption of silicon carbide (SiC) power semiconductor modules in e-mobility. The project aims to provide more efficient, reliable and functionally safe SiC MOSFET-based solutions for powertrain inverters comprised of NXPs advanced, high-performance GD3160 isolated HV Gate Drivers and Hitachi Energy’s …

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