Do you want to start 2024 with a bang? An unmissable day of innovation and networking will provide the perfect chance when Electronics Live and Instrumentation Live come together for the first time on 17 January 2024 at the National Conference Centre (NCC) in Birmingham The one-day table top exhibitions …
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The 5G industry has been booming, particularly in the networking slicing technology, which has enabled the development of an efficient transmission architecture for 5G networks. Network slicing allows carriers to build multiple networks to meet the differentiated requirements of different customers for network capabilities, which also brings new data storage …
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See the latest innovations up close and tap into a wealth of expertise at this brand-new one-day event for the electronics industry Electronics Live is coming to the National Conference Centre (NCC) in Birmingham on 17 January 2024. This inaugural table-top event is the perfect platform to source the latest …
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Now in stock at Powell Electronics, the supplier of connectors and more for high-rel applications including defence, aerospace and industrial, are 2nd generation one-piece GDBC direct board contacts from Gigalane. The simple one-piece design of the components enables a high integration and miniaturization of board-to-board and board-to-module RF interconnections. GDBC …
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Spirent Communications plc, the provider of test and assurance solutions for next-generation devices and networks, has released its “Accelerating Private Networking Value Creation” survey, providing insights on key trends and requirements around the adoption of 5G private mobile networks (PMNs). The survey identified technical and commercial drivers, challenges, service level …
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Picocom, the 5G Open RAN baseband semiconductor and software specialist, today announced that Contela, a developer and manufacturer of wireless communication equipment, is utilising Picocom’s PC802 5GNR/LTE baseband silicon and related PHY software in its upcoming 5G Open RAN Distributed Unit (O-DUs) and Radio Unit (O-RUs) products. By leveraging the …
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The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, has announced its new THERM-A-GAP PAD 80 high-performance gap filler pad is now available. This product is designed to provide designers of electronics and telecoms devices with a thermal conductivity of 8.3 W/m-K for superior …
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Nordic Semiconductor has announced its comprehensive, end-to-end cellular IoT solution with support for DECT NR+ (“NR+”). Comprising new products based on the award-winning and proven nRF91 Series Systems-in-Package (SiPs), Nordic’s new cellular IoT offering is designed to bring simplicity, stability, and cost efficiency through chipsets, modules, software, and services designed, …
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Rohde & Schwarz has announced a series of free seminars offering the latest updates in the world of wireless communications testing and measurement. Starting in the UK on 17 May 2023 and taking in Finland, Sweden, Italy and Spain, the seminars will be given by leading industry speakers Reiner Stuhlfauth …
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Semtech Corporation, a high-performance semiconductor, IoT systems, and Cloud connectivity service provider, has expanded its PerSe® product portfolio with the release of a new integrated circuit (IC) purpose-built for 5G mobile devices. Semtech’s PerSe technology senses human proximity and enables end devices such as smartphones to implement advanced radio frequency …
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CIE Components in Electronics