Archive

Printed Circuit Board production could be about to be revolutionised by an innovation from technology firm Rainbow Technology Systems. The new process represents a significant breakthrough for the electronics industry in that it incorporates coating, imaging and developing of PCBs in one compact, automated unit which promises to make board production faster, easier and more profitable.

Vector Fabrics has announced that it is joining forces with Thales in a move to help alleviate the issues involved in developing software for parallel architectures, while reducing power consumption. Electronic devices have greatly expanded their functionality with rich graphical user interfaces, high-speed internet access, high-quality photo and video cameras and 3D gaming which are all integrated into one device. However, the underlying parallel hardware architectures that enable this functionality have introduced new complications that this joint effort will look to address: programming complexity and power consumption.

CEVA, a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, is making a new silicon-based, software development kit (SDK) for runtime software development based on the CEVA-XC323 DSP architecture available. The CEVA-XC323 silicon embedded in the SDK was designed by CEVA and manufactured on a 65nm process, delivering up to 800MHz performance.

USB solutions specialist Future Technology Devices International Limited (FTDI) is adding to the range of input/output application boards (or ‘shields’) available for its Vinco development module. The move is intended to enable engineers to bring their designs to market more quickly. The new Vinco Touch Key shield mates with the Vinco motherboard, providing it with full touch pad functionality.

Frequency control specialist, Euroquartz has launched Statek’s latest crystal oscillator that has been designed for high temperature, high shock applications. The HGXOHT offers frequency output from 460kHz to 50MHz, and is capable of operating up to 225°C and can survive extremely high shocks – up to 100,000g.

Element14, the collaborative global electronics community established by Premier Farnell, has teamed up with Microchip and Matrix to introduce the new PIC18 Flowcode Developers Kit. This development and demonstration kit is designed to offer a hands-on, easy approach to electronics design using Flowcode, one of the world’s most advanced graphical programming languages for microcontrollers.

The enclosure specialist Schroff has unveiled a new microsite that focuses on electronics packaging solutions for the railway sector. The site looks to provide technical information, and has been developed to provide a resource for anyone involved in specifying electronics enclosures for applications on trains, at stations, in signal boxes or beside the track.

Camvine has extended the flexibility of its CODA cloud-based digital signage system with the launch of CODA Player for Windows, enabling users to view content on a desktop PC connected to the Internet. The launch expands the choice of media players for CODA, which also includes the plug & play CODApod, CODAsoft for integrated displays, and the recently launched CODA Player app for iPhone, iPod Touch or iPad.

Aeroflex Incorporated has announced a major feature upgrade to its 3920 Radio Test Set. The 3920 now supports P25 Phase II TDMA test functions and adds many new features for the development, manufacturing, and field test of both analogue and digital PMR radios and base stations used around the world.

Murata has commenced mass production of the ultra thin VSLBG2216E waterproof piezoelectric speaker. With a thickness of just 0.9 mm it is believed to be the world’s thinnest IPX7 speaker. Designed for consumer electronics applications, it is unlike other similar devices in that it does not require any additional waterproof membrane to be applied during end-product manufacture.