Archive

Sharp expands high brightness display line-up

Sharp is introducing a new 12.1"" (31 cm) industrial TFT LCD series of high brightness displays including a very robust model, the LQ121S1DC71, that has been designed for an expanded ambient temperature range from -15° C to 75° C and that can withstand higher mechanical loads caused by impacts and vibrations with a backlight operation life of 50,000 hours.

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OKW unveils the ‘blob’ – a new series of plastic enclosures

OKW has launched a new series of innovative plastic enclosures. With the ‘BLOB’ series OKW has sort to create a completely different style of housing that can employ touch and feel to impart the functionality of the electronics. The forms employed had to be suitable for a wide range of users with different hand sizes and grasping volumes.

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Teseq introduce 3-phase coupling/14/2/12 decoupling network series

Teseq, a developer of instrumentation and systems for EMC emission and immunity testing, has unveiled the CDN 3043 3-phase coupling/decoupling network series a high performance extension to the current NSG 3040 multifunction generator series. Six different models are available. All models feature common safety functions and range from a single function 16A unit up to a combined version rated at 32A. Higher current ratings are covered by the CDN 3063 series.

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Cree debuts LMH2 LED modules targeting European and Asian markets

Cree has announced that it is making the LMH2 module available to lighting manufacturers based in Europe and Asia. The LMH2 is designed to speed time-to-market and is currently the only LED module delivering 80 lumens-per-watt system efficacy combined with CRI greater than 90. The modules feature a new technology, TrueWhite, which generates white light with LEDs.

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Reference platform for wireless loudspeakers combines efficiency with audio performance

HiWave Technologies, a leading British manufacturer of components and sub assemblies for audio and haptic touch in consumer electronic products, has recently demonstrated a wireless speaker platform that produces 13W burst audio yet runs for over 30 hours at typical listening levels from one charge of a small lithium battery.

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Terasic unveils stackable Stratix IV FPGA platform

Terasic Technologies has launched a new TR4 high-density Altera Stratix IV FPGA platform. The platform can support Altera’s Stratix IV GX with 230K or 530K logic elements, and is able to offer engineers enhanced flexibility with its high number of available I/O pins, high speed, and low-power. A stacking mechanism is featured that makes it easier to choose the number of logic elements required for the end design.

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Aeroflex introduces Measurement Suite for WLAN 802.11ac devices

Aeroflex Limited is adding 802.11ac support to its PXI 3000 Series test system to support the worldwide growth of 802.11ac Wireless Local Area Network (WLAN) mobile devices. Wireless devices using the 802.11ac standard will see a 6X increase in network speed over 802.11n. They are faster because they use a less congested portion of the radio frequency (RF) spectrum, have wider bandwidth, and use more advanced digital modulation techniques.

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Altium and FTDI Chip collaborate on new board-level components

Altium, a developer of next-generation electronics design software and services, has announced that the full range of board-level IC component solutions from Future Technology Devices International (FTDI Chip) is now available for its electronics design software, Altium Designer, through the AltiumLive portal. Electronics designers using Altium Designer will have direct access to new components that include a comprehensive range of FTDI Chip devices that will be able to address most of their USB connectivity needs.

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Cadence collaborates with Samsung to deliver DFM solution for chip design

Cadence Design Systems has announced that Samsung Electronics’ Foundry business, Samsung Foundry, is collaborating with Cadence to develop a world-class design-for-manufacturing (DFM) infrastructure to produce the most advanced chips. Working closely together, Cadence and Samsung Foundry have developed “in-design” and signoff DFM flows to tackle physical signoff and electrical variability optimisation for 32-, 28- and 20-nanometer SoC designs. The new flows address both random and systematic yield issues, providing customers with a proven foundry option for advanced-node designs built on the Cadence Encounter digital and Cadence Virtuoso custom/analogue implementation solutions.

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Defence Minister opens TRaC’s new southern test site

Peter Luff MP, Minister for Defence Equipment, Support and Technology has opened TRaC"s new Southern Labs in Three Legged Cross, Wimborne, Dorset. The event marked the culmination of the most recent phase of TRaC"s plans to consolidate and expand its EMC and Environmental test services and the new site is the most modern test facility in the UK, offering a comprehensive range of EMC and Environmental test services.

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