Cadence shortens automotive verification closure with new Verification IP for UFS 3.0, CoaxPress, and HyperRAM

Cadence Design Systems, Inc. has announced three new Verification IP (VIP) offerings: the industry’s first CoaXPress VIP offering for high-speed imaging, the industry’s first HyperRAM high-speed memory VIP offering, and a VIP offering for the new JEDEC Universal Flash Storage (UFS) 3.0 specification. All three enable early adopters of these standards to begin designing with the new specifications immediately, ensuring compliance with the standard and achieving the fastest path to IP and system-on-chip (SoC) verification closure.

“Designers of SoCs for automotive applications face unique challenges of sustainability and reliability together with growing real-time processing needs that drive interfaces and memory standards innovation,” said Michal Siwinski, vice president of product engineering and management, System and Verification Group at Cadence. “These three new VIP offerings add to the total Cadence Verification Suite to help engineers easily achieve compliance with the latest standards for rapid high-quality design of innovative new automotive electronics.”

VIP for UFS 3.0

The UFS 3.0 specification doubles the throughput bandwidth from 1333MB/s in UFS 2.1 to 2666MB/s in UFS3.0 to address the growing bandwidth, low power and responsiveness requirements of advanced automotive and mobile designs. The UFS 3.0 Memory Model provides a full-stack solution, including support for MIPI Unified Protocol (UniPro) 1.8 and MIPI M-PHY 4.1, with comprehensive coverage model and test suite. This VIP offering also utilises Cadence TripleCheck technology for fast testing of all requirements for the specification.

“With the continuous evolution of memory specifications and the growing complexity of the protocols, early users of new standards need access to memory models that ease adoption,” said G.J. Perdaems, senior director of Managed NAND Solutions at Micron. “Our team is already utilising the Cadence UFS Memory Model successfully, and it’s encouraging to see Cadence continue its commitment to develop first-to-market solutions for the latest protocols. With the Cadence Memory Model for UFS 3.0, our engineers can confidently verify our designs with ease so they can keep their focus on designing managed memory solutions and delivering products to market faster.”

VIP for CoaXPress

The CoaXPress interface standard provides high-speed serial communication over coaxial cable. It is ideal for automated acquisition and analysis of video and images, which is becoming more important as engineers develop autonomous driving applications. It also can be used in other industrial and machine vision applications requiring transfer speeds up to 6.25Gbit/s. It utilises Cadence TripleCheck technology, which provides a verification plan with measurable objectives linked to the specification features and a comprehensive test suite with thousands of ready-to-run tests to ensure support for the specification.

VIP for HyperRAM

HyperRAM is a high-performance 333MB/sec read performance memory based on the HyperBus interface. It is ideal for applications that focus on a small footprint, including automotive, industrial and consumer applications.

These VIP offerings join the extensive Cadence VIP library, which provides a comprehensive  portfolio for automotive applications including LPDDR 4/5, Ethernet TSN, MIPI CSI-2, DSI-2and I3CDisplayPort, CANand eMMC.

These VIP offerings are part of the Cadence Verification Suiteand are optimised for Xcelium Parallel Logic Simulation, along with supported third-party simulators. They support the company’s System Design Enablement strategy, which enables system and semiconductor companies to create complete, differentiated end products more efficiently. The Verification Suite is comprised of best-in-class core engines, verification fabric technologies and solutions that increase design quality and throughput, fulfilling verification requirements for a wide variety of applications and vertical segments.

Check Also

Smiths Interconnect launches new best-in-class RF filter solutions in the X, Ku, and Ka bands

Smiths Interconnect, a provider of technically differentiated electronic components, subsystems, microwave, optical and radio frequency …