CIE Components in Electronics
Gap Filler 4000 from Bergquist is the company’s latest and highest performing dispensable thermal interface material, delivering thermal conductivity of 4.0 W/m-K and extended working time of up to four hours allowing greater flexibility in dispensing and assembly processes.
The two-part liquid material has shear thinning characteristics for optimum dispensing, and displays excellent wetting with ultra conformability to minimise stress on components during assembly. Ideal for filling unique and intricate air voids and gaps, Gap Filler 4000 remains in place after dispensing and maintains its shape on the target surface. It has a low level of natural tack, and is intended for applications where a strong structural bond is not required. Cure time is 24 hours at room temperature or 30 minutes at 100°C.
Gap Filler 4000 extends Bergquist’s Gap Filler family of liquid dispensable materials, which now offers eight formulations with thermal conductivity ranging from 1.0 W/m-K to 4.0 W/m-K. Among these are two-part gap fillers including silicone-free formulas for silicone-sensitive applications and versions with very low outgassing for use where effects such as lens fogging may be a concern. One-part non-cure materials are also available.
Unlike pre-formed gap fillers, these liquid dispensed materials offer infinite thickness options and eliminate the need for specific pad thicknesses or die-cut shapes for individual applications.
