AVX Corporation has introduced a new series of low profile, best in class 0805 MLO diplexers based on its patented multilayer organic high density interconnect technology. AVX’s new MLO diplexers incorporate high dielectric constant and low loss materials to provide high Q printed passive elements, such as inductors and capacitors in multilayer stack ups.
Featuring low insertion losses, low parasitics, a low profile (<0.6mm), and improved solderability, the new 0805 Series diplexers support several wireless standards, including WCDMA, CDMA, WLAN, and GSM, and are ideally suited for band switching in dual and multiband systems.
“AVX’s MLO technology has enabled us to create diplexers with lower insertion losses and better attenuation than equivalent LTCC products,” said Larry Eisenberger, Senior Marketing Application Engineer at AVX.
AVX’s 0805 Series diplexers measure a diminutive 2.12mm x 1.28mm x 0.55mm (0.083” x 0.050” x 0.021”), are rated for use in temperatures ranging from -40°C to +85°C, feature a maximum power capacity of 4.5W, and are expansion matched to most PCB materials.
Available in four frequencies and two terminations (Au and Ni/Sn), both of which are compatible with automatic soldering technologies, AVX’s 0805 Series diplexers feature standard tape and reel packaging and are 100% tested for electrical parameters and visual characteristics.