CIE Components in Electronics
AVX Corporation has released the TCN PulseCap Series ot tantalum solid electrolytic chip capacitors, a polymer electrode version of the company”s high capacitance, and high energy TLN PulseCap Series and which will be targeted at high energy applications.
Available in the same single, large, low-profile case size (EIA 7361-20) as its parent series, which enables a capacitance range spanning 220µF to 1500µF, the TCN PulseCap Series capacitors feature undertab terminations for high volumetric efficiency and high PCB assembly density, in addition to a conductive polymer cathode for reduced ignition and low ESR. TCN PulseCap Series capacitors are ideal for use as energy bank capacitors in solid state drives (eSSDs) and external hard disk drives (eHHDs), as well as for a wide range of wireless transmitters, including smart meters and smartcards.
“Featuring a low-profile 2mm height and undertab terminations instead of solder joints on the side of the capacitor body, the new TCN PulseCap Series tantalum chip capacitors enable high volumetric efficiency and PCB assembly density, making them ideal for applications that require both high energy and low profiles, such as eSSD and eHDD devices,” said Allen Mayar, product marketing manager at AVX.
Lead-free compatible and RoHS compliant, TCN PulseCap Series capacitors are rated for -55°C to +85°C and 6.3VDC or 16VDC. The series also features ±20% capacitance tolerance and 0.1CV DC leakage current, and is suitable for 3x reflow solder processing at 260°C.
