AVX Corporation has launched a new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, Washington. Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO diplexer employs high dielectric constant and low loss materials to realise high Q passive printed elements, such as inductors and capacitors in a multilayer stack up.
Capable of supporting multiple wireless standards, including: WCDMA, CDMA, WLAN, GSM, and BT, the 0603 diplexers are suited for band switching in dual- and multiband applications, such as WiFi, WiMax, GPS, and cellular bands.
Using land grid array packaging technology the new 0603 diplexers have an inherently low profile (0.5mm) and exhibit excellent solderability, low parasitics, and high heat dissipation. Expansion matched to PCBs, the diplexers also provide improved reliability with regards to comparable ceramic or silicon components.
“Our 0805 MLO diplexer, released earlier this year, has been well received within the RF industry, so we’re very pleased to be able to release the smaller form factor here at the International Microwave Symposium,” said Larry Eisenberger, senior marketing application engineer at AVX.
AVX’s new diplexer features a maximum power capacity of 4.5W, measures 1.65mm x 0.88mm x 0.42mm (0.065” x 0.035” x 0.017”), is rated for use in temperatures ranging from -40°C to +85°C, and is available in Ni Au, Ni Sn, and OSP finishes, all of which are compatible with automatic soldering technologies. Finished parts are 100% tested for electrical parameters and visual characteristics and are packaged on tape and reel.