Toshiba Electronics Europe (TEE) has made a key addition to its extensive portfolio of solutions for the automotive market. The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car. The new companion chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front/rear/surround-view cameras, digital audio and transferring high-resolution video content to head-unit and rear-seat entertainment systems.
The TC358791XBG has been designed to seamlessly interface with and support many leading-edge automotive application processors on the market, thanks to its USB 3.0 and MIPI CSI2 and DSI connectivity for both audio and video, and will conform to Automotive Electronics Council reliability specification AEC-Q100 (Grade 3).
The TC358791XBG can split one video input into two pictures and can simultaneously drive two high-resolution low-voltage differential signalling (LVDS) digital displays. Examples include head units, instrument clusters, and parking aid vision systems. The chip can also send high-resolution audio and video data from the host processor to multiple displays or other electronic control units in the car, and it has a High Definition Multimedia Interface (HDMI) 1.4 receiver interface to connect smartphones and other HDMI-enabled devices to the application processor.
The new chipset is housed in a FBGA257 15mm x 15mm package and 0.8 mm ball pitch. Additional features include differential CVBS (composite) interfaces for analogue composite video sources, support for early back-up camera view (CVBS to LVDS), and ability to relay packetized IQ audio tuner data to the host via USB.
Samples of the TC358791XBG automotive infotainment chipset are available now.