CIE Components in Electronics
ams, a leading worldwide supplier of high-performance sensor solutions, and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, jointly announced the intent to focus engineering efforts towards a 3D depth sensing camera solution for mobile phone applications like 3D imaging and scanning and, in particular, biometric face authentication.
With ams’ advanced VCSEL light sources and optical IR pattern technology incorporating mass- production proven wafer level optics and Qualcomm Snapdragon Mobile Platforms, the companies have a goal to create a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones. Use cases for the platform solution could include front-facing applications that require advanced 3D imaging such as face recognition required for secure online payments as well as other applications like dynamic-depth facial scanning.
“Qualcomm Technologies is committed to providing active depth camera solutions to our customers,” said Keith Kressin, senior vice president, product management, Qualcomm Technologies, Inc. “We’re excited to work with ams on the development and commercialisation of this reference design with the goal of bringing these depth sensing solutions to consumers in the future.”
Alexander Everke, CEO of ams, commented on the announcement: “ams provides the full range of IR illumination devices specifically designed to address the three 3D technologies Active Stereo Vision, Structured Light and Time-of-Flight (ToF). Utilising this leading capability together with Qualcomm Technologies’ mobile application processors for active stereo camera solutions is an exciting opportunity. We want to enable fast time-to-commercialisation and broad-based availability of high quality 3D sensing solutions for Android-based smartphones and mobile devices, and this is a step towards this goal.”
