Amphenol Enhances its RADSOK Technology

RADSOK R4 delivers connections up to 200 A

Sidney, N.Y. November 2013 – Amphenol Industrial Global Operations, a global leader in interconnect systems, has enhanced the technology in its high current contact system to RADSOK R4. This improved system is available in board-to-board, wire-to-board and busbar-to-board configurations. Ideal for use by both server and board manufacturers the enhanced product delivers connections up to 200 A, its hyperbolic grid contact provides multiple points of contact and a high contact surface area for efficient and low resistance power transmission.

RADSOK R4 features a lower temperature rise than traditional contact systems, giving a smaller overall connector packaging and compact footprints. A 25% reduction in outside diameter helps to further increase power density as well as saving space and its laser welded assembly offers users better mechanical strength.

Amphenol’s RADSOK R4 is easily configured to specific application requirements. The versatile contact can be efficiently adapted to custom packaging with minimal non-recurring engineering costs, whilst its proven radial contact design offers superior mechanical and electrical performance for high current board termination, offering more consistent performance as well as lower voltage drop and contact resistance.

A Super Twist version is available for applications that require enhanced radial float tolerance and blind mate or mechanical robustness,

The following products all use the Company’s new technology:

·         RADSTACK, a high current mezzanine board stacking system;

·         RADFIN, a low profile, right angel receptacle;

·         PowerBlok, a connector that provides a high current single-point connection of up to 150 A to the PCB utilizing the RADSOK Super Twist contact system;

·         RADSERT, contacts that provides a high power-to-board interconnect;

 PGY, an orthogonal connector series available in multiples sizes from 35 to 150 A

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