CIE Components in Electronics
ERS’ newest innovation in thermal testing, is a family of 4th generation thermal chucks – developed together with MPI Corporation. Available for 300mm (12″) wafers.
Key features of PRIME:
- Industry’s lowest soaking time
- Ultra-low noise
- Fast transition times
- Highest flexibility with modular surface design
- PRIME Thermo Shield (PTS)
- Incredible Temperature Accuracy ± 0.08°C
The PTS is integrated into the chucks, which leads to an estimated 2/3rd reduction in soaking times vs previous ERS chucks.
Temperature range of -60°C to 300°C. The chuck can reach test temperatures down to -10°C with NO chiller required, and -40°C with only a small chiller (1/3rd the size of a regular ERS chiller).
Superior Chuck flatness ensures the ideal contact area for the wafer. The extremely rigid ERS chucks easily withstand the thermal and force stresses encountered in the use of high pin-count probe cards.
Exceptionally long lifetime and reliability – ERS AirCool systems have recorded MTBF values of over 50,000 hours; almost 6 years uptime without interruption.
ERS AirCool ® PRIME won the Electronics Industry Award in the category “Test, Measurement & Inspection Product of the Year” – highlighting our statement for product features: Uncompromised excellence in all disciplines.
