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Murata unveils new technology roadmap for 2010
Published:  23 November, 2009

UHF reader/writer module

Murata has revealed details of key products in what is a diverse technology roadmap for 2010. Key developments for next year include technologies for automotive and consumer electronics, the world's smallest UHF reader/writer module for RFID applications, a new passive device for circumventing open defects in LED lighting, a growing micro-mechatronics portfolio, and two new capacitor technologies.

Among the highlights include an anti-fuse element developed for controlling open defects in LEDs. If one LED in a serially connected string fails the anti-fuse element keeps all others switched on. The technology will be used in all types of LED lighting, and is especially suitable for large, outdoor, high-maintenance lighting fixtures.

 

Murata will also be introducing a piezoelectric micro-blower as part of its growing micro-mechatronics range. The 20 x 20 x 1.85mm device provides forced-air cooling in confined spaces in consumer, industrial and automotive electronics. Inside the device it has a piezoelectric diaphragm that vibrates when a voltage is applied, pushing air through a nozzle at the top. Power consumption, according to Murata, is minimal and the low power device has been designed to be used to cool CCD image sensors, LCD backlights and ICs. (Video action: take a look at the micro-blower in operation at the end of this article.)

 

Expanding its RFID product range, Murata will introduce an embedded UHF reader/writer module, designed for use with its MAGICSTRAP range of RFID modules for RFID tags. The modules will features an integrated RFIC, baseband IC and matching circuit in the world's smallest package: just 23 x 13 x 2 mm. Applications will include RFID readers and writers, and RFID label printers.

 

MLSCs (multi-layer series capacitors)

Two new capacitor technologies for the automotive sector will also emerge in 2010. Both have been developed to better withstand the severe flexing, vibration and demanding thermal conditions in automotive applications. The first is a soft termination technology, where a conductive resin between the copper electrode and the nickel/tin plating of the termination enhances mechanical strength when multilayer ceramic capacitors are subjected to bending stresses. The second is the introduction of MLSCs (multi-layer series capacitors), featuring two capacitors connected in series within the same device. This reduces the risk of short circuits as a result of bending stresses and solder-shock cracks between the two devices. In field trials, these new components have demonstrated high reliability, high breakdown voltage and excellent pulse strength.

 

Murata also plans to increase the number of devices in its Thermo-String range of automotive-qualified, long-lead thermistors. Each device features an NTC chip thermistor in its ultra-small 'head'. Since hot spots do not only occur on the PCB or motherboard, Thermo-String's long leads of polyurethane coated copper wire allow the head of the thermistor to be situated very close to potential problem areas, even in narrow or small locations.

 




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