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Kontron has unveiled its newly defined Computer-on-Module (COM) standard for an upcoming ultra low-power embedded architecture platform family, which marks a significant milestone in the company’s recently announced strategic entry into the ARM market.
The new COM standard features a slim form factor designed for the company's future ultra low-power, off-the-shelf platforms, including: embedded handheld devices and rugged tablets, as well as, box PCs and HMI systems. By extending the COM usage model to RISC architectures with scalable, modular and out-of-the-box solutions, Kontron's new module standard bridges the gap between current proprietary industrial offerings and offerings from the consumer market - a far less suitable solution for demanding environments.
ADLINK has committed to support the new standard and this will enable OEMs and system integrators to have a second source for Kontron's newly defined COM.
The new COM standard was developed to encompass a new range of modules for ARM and SOC processors. Based on the 314-pin MXM 3.0 connector that is only 4.3mm in height, it enables durable and slim designs with a cost-efficient horizontal card edge/goldfinger connection. The connector is also available in a shock and vibration proof construction suitable for harsh environments.
The standard enables new interfaces specifically for the new ARM and SOC platforms including video outputs such as LVDS. Looking down the road, the standard will also allow for the use of DisplayPort 24-bit RGB and HDMI.
Another first are the dedicated camera interfaces, which are included in the standard, minimizing design efforts and BOM. As a result, users no longer need to compromise or work with inefficient standards that are stretched between the x86 feature set and lean ARM and SOC I/Os. Initially covered under the standard are two module footprints to offer flexibility for different mechanical requirements: a short module measuring 82 mm x 50 mm and a full size module measuring 82 mm x 80 mm. Other sections of the standard address the already familiar requirements of other module standards, resulting in the latest 1.0 version achieving a high-degree of maturity. More details are available under NDA.
"Our strategic entry and massive investment is spearheaded not only by upcoming product launches, but moreover by a new Computer-on-Modules form factor standard for these new products. This emphasises our commitment to the standardisation of scalable technologies right from the onset," Dirk Finstel, CTO of Kontron explained. "We have been very successful with embedded form factor standardisation and particularly with ETX and COM Express standards. Now we have begun to mirror this success in the ARM and SOC market segment, which complements that of x86 technology. Customers will benefit from the new massively reduced R&D investment costs, by utilizing application ready platform solutions, that have not been available in their sectors prior to this standard. And we are very happy to have ADLINK on board to support this standard. This will accelerate its success."
The first Kontron ARM-based module early field testing platforms will be available in Q1 2012. Official product launches are expected shortly after.
