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Picochip has unveiled the next generation of its picoXcell femtocell chips, the PC3008. The new device has been optimised for high-volume cost-sensitive consumer applications. The PC3008 is the first in the PC30xx family of devices, Picochip’s third generation of femtocell (Home NodeB) devices.
The PC3008 supports eight users with Release 7 HSPA+ (21Mbps downlink, 5Mbps uplink), and embodies Picochip’s field-proven PHY, that’s already been approved by a number of operators, reducing the risks and time-to-market for system developers. It is manufactured using 40nm process technology and features a fast (950MHz) ARM11 processor with TrustZone.
Compared to previous SoCs it enhances security functions and increases integration, reducing external component count and hence bill-of-materials (BOM). It also includes optimized support for next generation low-cost and low-power femtocell radios.
The PC3008 integrates the key components of a 3G femtocell into an aQFN package just 12mm (0.5inch) square, enabling OEMs to produce smaller and more cost-effective femtocells. As a demonstration of the low power, small size and integration that PC30xx series devices will enable, Picochip shared an example of an HSPA+ femtocell in a USB dongle – the world’s smallest 3G basestation.
According to ABI’s most recent report, there were 1.3M femtocells shipped in 2010, rising to 70.2 million in 2015, a 154% CAGR.
As well as the device itself, Picochip is offering a complete reference design including hardware platforms, radio designs, together with manufacturing support and complete protocol stack. The availability of ultra-small femtocells will allow operators to easily develop HSPA+ home-basestation capabilities to appliances such as residential gateways, cable modems and set-top boxes.
The PC3008 will be shipping in volume by end of the year. Other devices in the PC3xxx family will be announced later this year.
