- 07 February, 2012
Mobile Network Test Seminars - 15 - 16 February, 2012
Southern Electronics - 08 March, 2012
UK Technology Day - 23 May, 2012
ElectroTestExpo
Samsung Electronics has developed two new CMOS image sensors - the S5K4E2 and the S5K5CA - for the mobile phone market. Designers and manufacturers of high-end smart phones and slim mobile handsets will be able integrate one of these small form factor imagers into their next generation design.
"Consumers want a more feature rich experience when using their mobile handsets," said Dr. Dojun Rhee, vice president, System LSI marketing, Samsung Electronics. "To meet the diverse needs of the mobile phone market, we've expanded our product line-up to include imagers that support HD video capabilities while fitting into an ever decreasing module space."
Using its proprietary pixel technology SEES (Samsung Enhanced Energy Steering), Samsung's new S5K4E2 imager is an ultra-sensitive 1/4-inch, 1.4 micron, 5Mpixel chip with an integrated extended depth of field (EDoF) IP. The EDoF enables in-focus range from 15cm to infinity with optimum image quality. The new functionality supports the barcode and business card scanning features available in mobile operating systems.
In addition, Samsung's new 5Mpixel imager can capture clear video images at up to 15 frames per second at full resolution. The SEES pixel, integrates more light into an optimised pixel structure to present clear, high resolution images. Advanced noise removal logic is also used to further improve image performance.
Designed to fit into a 6.5mm x 6.5mm module with a height dimension of 4.5mm, the S5K4E2 imager is suitable for ultra slim smart phones and other imaging applications. The S5K4E2 also supports 1.2V digital power supply voltage for low power consumption and has a four-channel anti-shading correction feature for image enhancement processing.
The new S5K5CA is a 1/5-inch, 1.4 micron, 3Mpixel imager that combines both the image signal processor (ISP) with the CMOS image sensor into a single system-on-chip (SoC) solution. As a result Samsung is able to reduce the overall module size by 25 percent over its preceding 3Mpixel SOC imager, the quarter-inch 1.75-micron 3Mpixel solution. This SoC is suitable for 6.5mm x 6.5mm fixed focus camera modules; the current small form factor requirement for slim mobile handsets.
