Thermal Management

Thermally conductive dispensable PCM interface paste, 3.5W/m.K

New from European Thermodynamics – the latest addition to the thermal interface material range from brand Global Component Sourcing (GCS), the phase change material GCS-TRP35-PCM. Ideally suited to fill spaces of up to 0.15mm, the GCS-TRP35-PCM phase change thermal interface material is used to fill air gaps/voids between two surfaces. …

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New 6SigmaET release enhances modelling for faster thermal simulation

Future Facilities has launched Release 12 of its leading thermal simulation software, 6SigmaET. The latest release incorporates a number of significant modelling enhancements that deliver another boost to overall simulation speed – extending 6SigmaET’s performance advantage compared to alternative tools. Release 12 also includes a prototype virtual reality (VR) visualisation …

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Future Facilities launches neutral file format for thermal simulation models

Future Facilities, provider of leading thermal simulation tool, 6SigmaET, has today announced the availability of a new neutral file format that will help solve the challenge of sharing design models between different thermal simulation toolsets. The new file type will enable seamless file interchangeability – removing a major bottleneck in …

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Nearly three quarters of thermal engineers report dissatisfaction with their simulation software packages

As increasingly intricate product designs and shorter time-to-market deadlines put pressure on engineers to solve their thermal equations reliably and accurately, 71 per cent have reported their dissatisfaction with their current thermal simulation software packages. Despite this, 60 per cent admitted to having not switched provider in over three years. …

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Phase change thermal conductive material

Company Fischer Elektronik GmbH & Co. KG extends their extensive product portfolio of thermal contact materials by new phase change thermal conductive materials which provide an alternative to the conventional thermal conductive pastes. The new material types combine the advantages of high thermal performance together with the reliability of phase …

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6SigmaET and Advanced Thermal Solutions agree strategic thermal simulation partnership

Engineering simulation software leader, Future Facilities, and, the thermal industries innovation leader, Advanced Thermal Solutions, Inc. (ATS) is pleased to announce that ATS has purchased multiple seats of 6SigmaET. The software will be used for simulations for different problem domains in thermal management of electronics. Kaveh Azar, president and CEO of ATS, …

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Two thirds of thermal engineers must spend a day or more solving their designs, limiting efficiency and time-to-market

Despite legacy systems, industry-wide research finds thermal engineers still refuse to update 66 per cent of thermal engineers must wait at least a day for their thermal simulations to solve. That’s according to the new State of Thermal report from 6SigmaET, which asked 170 thermal engineers in the electronics industry – including …

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AT&S enables “cool” designs for miniaturised high-power applications

Embedded and inserted heat pipes significantly improve heat dissipation Miniaturisation and increasing power densities are major concerns for modern electronic applications. The lifetime of electronic applications can be dramatically reduced by the increase of the working temperatures by just a few degrees. Further, the insulation of the whole printed circuit …

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Rapid TIM prototyping on production tooling

Thermal Issues Ltd is a progressive player in the Thermal Interface Materials market. The company specialises in the provision of standard and custom pad shapes manufactured from thermally conductive, electrically isolating, EMC-protection and sealing / vibration damping materials from trusted, world-renowned suppliers. The demand for cooling electronics is increasing; applications …

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It pays to stay cool when designing measures to prolong the lifetime of electronic components

The temperature range of individual electronic components impairs or prolongs the lifetime of an entire system setup enormously. With increasing density, more compact designs and ever-increasing computing power, there is a growing need for selective cooling that is carefully chosen in advance to counter the rising power losses in components. …

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