Automotive

AMD powers next-gen automotive Edge sensors with new additions to its cost-optimized automotive-grade family

Edge sensors, such as LiDAR, radar and 3D surround-view camera systems, are becoming more prevalent in the automotive market, especially with the growing adoption in autonomous driving. As more sensors are needed for autonomy, there are increasing needs for faster signal processing, reduced device costs and smaller form factors. Functional …

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Pickering Interfaces to demo EV BMS test rig at Automotive Testing Expo 2023, Europe

Pickering Interfaces, the provider of modular signal switching & simulation products for electronic test & verification, will showcase its Battery Management System (BMS) test demo on booth 1188 at Automotive Testing Expo 2023, Europe, at Messe Stuttgart in Germany from 13-15 June 2023. The world’s leading show for automotive testing, …

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Tektronix Innovation Forum 2023 offers attendees insight into key technology trends

Test and measurement company Tektronix, Inc. has announced its Tektronix Innovation Forum 2023 event series. Available for a global audience and offering multiple educational sessions on key electronics technologies, the event series will include educational forums, panel discussions and technical presentations with admission offered at no charge. Under the theme …

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Vicor to unveil modular solution for inverter ripple currents in EV power delivery networks at EEHE 2023

Vicor, the specialist in high‑performance power modules, has announced its participation at Electronic & Electrical Systems in Hybrid & Electric vehicles (EEHE) 2023 in Essen, Germany. As one of Europe’s leading vehicle electrification conferences, EEHE takes place on 13 – 14 June and targets manufacturers, suppliers, development partners and employees …

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Analog Devices invests €630 million in next generation semiconductor R&D and manufacturing facility in Limerick

Analog Devices, Inc., a global semiconductor leader, has announced a new €630 million investment at its European regional headquarters in the Raheen Business Park in Limerick, Ireland. The investment enables the construction of a new, state-of-the-art, 45,000 sq-ft research & development and manufacturing facility. The new facility will support ADI’s …

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NXP and TSMC to deliver “industry’s first” automotive 16 nm FinFET embedded MRAM

NXP Semiconductors, the specialist in automotive processing, has collaborated with TSMC to deliver what it describes as the industry’s first automotive embedded MRAM (Magnetic Random Access Memory) in 16 nm FinFET technology. As automakers transition to software-defined vehicles (SDVs), they need to support multiple generations of software upgrades on a …

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New onsemi Hyperlux image sensor family leads the way in next-generation ADAS to make cars safer

onsemi, a specialist in intelligent power and sensing technologies, has launched its Hyperlux automotive image sensor family. With a 2.1 µm pixel size, 150dB ultra high dynamic range (HDR) and LED flicker mitigation (LFM) across the full automotive temperature range, the Hyperlux family provides high performance, speed and advanced features …

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Suitable connections for a wide range of applications: The Mini-Fit connector family from Molex at Rutronik

The Mini-Fit connectors from Molex are designed to impress with their high flexibility and are said to be excellent for use even with difficult designs. They are both mutually and downwardly compatible in their respective category. With options such as dummy plugs or contact positioning fuses, the Mini-Fit family of …

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KAMIC Group acquires AGW Electronics, British manufacturer of customised wound components

KAMIC Group has acquired, via its subsidiary ETAL (UK) Ltd., all the shares in AGW Electronics Ltd. The sellers are Nigel Godwin, who is also the company’s managing director, Tony Godwin, Anette Godwin and Sara Boulton. AGW Electronics was founded in 1975 and is today one of the leading UK …

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Reliable in harsh environments and at high temperatures: KEMET´s X2 film capacitors of the R53B series at Rutronik

With the R53B series, KEMET Corporation expands its range with new EMI suppression capacitors made of metalized polypropylene film. They operate extremely reliably even at particularly high temperatures (up to 125 °C) and meet UL 94 V-O specifications thanks to an envelope of self-extinguishing resin in the housing. Target applications …

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