Comments & Opinions
ICs & Semiconductors
Wireless & Communications
Components in Electronics
Skip over navigation
New series of radiation hardened DC-DC power conversion products for space power systems
VPT Inc., a HEICO company, is making available a new series of radiation hardened DC-DC power converters, point of load converters, and EMI filters to power space systems. The new SVR Series of space power products includes 24 new modules in 7 product families, all based on space-proven heritage designs and available qualified to MIL-PRF-38534 Class K and are the
first power conversion products commercially available that are out-of-the-box compliant to the new Aerospace Technical Operating Report (TOR) requirements for space power systems.
Murata introduces 420W PMBus compliant 1/4 brick
Murata has introduced the UDQ series of isolated digitally controlled DC-DC converters developed by Murata Power Solutions. Incorporating a 32-bit ARM7 processor, the 420 Watt regulated UDQ2204/001 model is the first in a series of DC-DC converters from the company to include a PMBus compatible digital interface.
Highly integrated PFC IC for compact consumer products and PCs
Power Integrations has introduced the HiperPFS-2, a new family of high-efficiency, active-PFC ICs for offline applications from 100 W to 380 W. HiperPFS-2 ICs combine a boost PFC controller, driver, PFC MOSFET, PFC diode and protection circuits in one package, enabling exceptionally compact designs ideal for small-form-factor power supplies as used in mini-tower PCs, all-in-one PCs, game console adapters and TVs.
Latest power technology targets greener industry and infrastructure
Buck regulator power-supply IC with low quiescent current standby mode
First commercially available silicon carbide (SiC) six-pack power module from Cree
Vicor expands Picor isolated cool-power ZVS DC-DC converter module line up
Next generation 500 mA DC switching regulator series from CUI
IR’s 40V automotive-qualified COOLiRFET delivers system efficiency in heavy load applications
New line of industrial grade safety disc capacitors
KEMET, a manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, has released a new Radial Through Hole Ceramic Safety Disc Capacitor targeting markets that include alternative energy, industrial/lighting, medical, and telecommunications. The Safety Discs Capacitors complement KEMET’s ERO610, ERK610, ERP610, KJY, KJN series, and FILM EMI suppression capacitors.
Riedon introduces ultra-high precision foil resistors in leaded and surface mount packages
AVX receives Defense Logistics Agency approval for Accu-P thin film capacitors
Euroquartz adds to low-EMI oscillator range with new 18HM series
AVX adds several new varistors to its TransGuard & TransGuard auto series
ON Semiconductor gets development funding for next-generation Star Tracker image sensor
ON Semiconductor, in collaboration with SRI International and Ball Aerospace & Technologies, has secured funding for the Defense Production Act Title III, Advanced Complementary Metal Oxide Semiconductor (CMOS) Focal Plane Arrays (FPA) for Visible Sensors for Star Trackers (VSST) Project. The project aims to increase the availability of domestically produced visible imagers, manufactured using advanced CMOS technology, that are designed to enable flexible visible imaging systems for use on-board satellite systems for Department of Defense and other U.S. Government needs.
Annual shipments of sports and fitness monitors to top 56m by 2017
Cambridge Nanotherm takes first step towards mass manufacturing
Altera to acquire power technology innovator Enpirion
LogMeIn and ARM collaborate to drive commercial products on the Internet of Things
Wireless & Communications
Dialog SmartBond Bluetooth low energy wireless connectivity chip unveiled
Dialog Semiconductor, a provider of integrated power management, audio and short-range wireless technologies, has launched SmartBond, said to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip (SoC), which is able to more than double the battery life of an app-enabled smartphone accessory or computer peripheral in comparison to competing solutions currently on the market.
New Triplexer LC filter supports PMR communications between emergency services
Peregrine Semi introduces SPDT RF switch for harsh space environments
MIMOtech launches ultra high capacity radio for last mile LTE backhaul
SPDT switch designed to increase network capacity and higher data rates
ICs & Semiconductors
New OMAP5432 processor-based evaluation module targets industrial applications
In a move intended to help developers jumpstart their product designs, Texas Instruments (TI) has introduced the OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications. The EVM enables quick, easy evaluation and benchmarking for applications demanding high-performance processing and graphics at low power, including human machine interface (HMI), portable data terminals (PDT), digital signage and medical monitoring end equipment.
Atmel microcontrollers power Secret Labs’ ultra-low-power Smart Watch
CISSOID unveils OPAL a new high temperature sensor
NXP accelerates MFi accessory development
Energy Micro Cortex-M4 MCU achieves performance benefits using low leakage process
Gimme Five – Dunstan Power
Dunstan Power, director and co-founder of Bytesnap Design, talks to Steve Rogerson in our series of interviews for CIEonline. Having graduated with a degree in engineering from Cambridge University, Power has been working in the electronics industry since 1992. In 2004 he founded Diglis Design, an electronic design consultancy, where he developed a number of electronic boards and FPGA designs. In 2008, he teamed up with former colleague Graeme Wintle to establish Bytesnap Design to supply clients with integrated software development and embedded design services.
Gimme Five – Manfred Schmitz
Gimme Five - Nigel Forrester
Gimme Five - Chris Hills
Gimme Five – Alfred Hesener
RS Components stocks Amphenol HD-BNC family
RS Components (RS) is stocking the High Density BNC (HD-BNC) family of connectors from Amphenol. With a footprint 51% smaller than traditional BNC connectors, and 40% smaller than DIN 1.0/2.3, the HD-BNC allows four times as many interconnects as the BNC, and makes it possible to reduce equipment size and weight in applications requiring high definition resolution, such as in broadcast and digital video (HDTV), as well as in network routing and switching.
L2Tek adds long-reach cable equalizer chips from Semtech to its broadcast portfolio
Black to the future with new BeagleBone from Rapid Electronics
Ginsbury introduce Kyocera Super Wide View (SWV) TFTs
Future Electronics signs new franchise agreement with TechNexion
Terms & Conditions
© 2012 - 2013 Specialist Business Media Ltd. All rights reserved.
Registered in England No: 1771113.
Registered Office: 8 - 9 Dryden Street,
Covent Garden, London WC2E 9NA.