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ICs & Semiconductors
Automotive infotainment companion chip supports multimedia connectivity and camera devices
Toshiba Electronics Europe (TEE) has made a key addition to its extensive portfolio of solutions for the automotive market. The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car. The new companion chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front/rear/surround-view cameras, digital audio and transferring high-resolution video content to head-unit and rear-seat entertainment systems.
Multi-output boost converter LED driver ICs with fault-tolerant protection
New from Allego MicroSystems Europe, the A8518 and A8519 are the latest additions to the company’s portfolio of LED driver ICs for LCD backlighting applications and are multi-output boost converter devices with built-in fault-tolerant protection.
Freescale introduces small integrated tire pressure monitoring system
Freescale Semiconductor has introduced the FXTH87, a tire pressure monitoring system (TPMS) family, which is the smallest integrated package TPMS solution currently available with a weight of just 0.3 grams. The family of devices is 50 percent smaller than competing products, helping designers reduce overall bill of materials costs.
Renesas Electronics and port GmbH unveil range of multi-protocol connectivity solutions
Exar's DX2040 doubles Hadoop performance
IDT extends SoC-friendly ultra-low-power clock family
Freescale looks to drive IoT innovation
TI simplifies low-power microcontroller development with non-volatile FRAM, flexible on-chip LCD controller and abundant I/O
Cortus targets sensors, wearables and IoT with low power embedded 32-bit processor core
EdgeMate Wire-to-Edgecard power connectors eliminate mating headers
Molex Incorporated’s 3.96mm pitch EdgeMate Wire-to-Edgecard power connectors eliminate the need for mating headers, resulting in cost and time savings. This system supports power applications of up to 7.0A with UL 94V-2 flammability rating requirements.
Space saving antenna connector from Hirose Electric
Panel feed-through housings offer sealing on both sides suited to fire protection on rail vehicles
Molex offers FEP MIL-spec approved flat-ribbon cable
ERNI Electronics introduces high-density and compact high-speed connectors
TVS Diode Array provides five channels of ESD protection in footprint that typically contains only one
Littelfuse has introduced the SP1012 Series TVS Diode Array (SPA Diodes), a miniature, five-channel 6.5pF, 15kV bidirectional TVS array for general-purpose electrostatic discharge (ESD) protection. The SP1012 Series packs five ESD diodes in a 0402-size (0.94mm x 0.61mm) flipchip package that would normally contain only one, so offering a 5x improvement over previous implementations.
New power analogue controllers offer increased digital power-supply flexibility
40V, 400mA(IOUT), 2.2MHz step-down regulator comes with dual tracking LDOs
Rad-hard voltage references from STMicroelectronics
Murata expands front-end AC-DC power supply products
Mobile interference hunting system makes locating interferers faster and easier
Anritsu Company has unveiled what it describes as a revolutionary mobile interference hunting system that will helps field engineers and technicians locate sources of interference more accurately, efficiently, and economically. Integrating an easy-to-use interface, fast setup times, and numerous features to effectively hunt a variety of signal types in multiple RF environments, the comprehensive solution provides wireless carriers, regulatory agencies, and broadcast and satellite operators with a tool that saves time and money.
Wind River debuts simplified delivery of embedded Linux to enable faster project starts
New online condition monitoring solution looks to address big analogue data challenges
Anritsu upgrades popular MP1800A signal quality analyser
Synopsys looks to automate design of next Generation photonic Integrated Circuits (PICs)
RS Components adds to its range of rapid-prototyping 3D print machines
RS Components (RS) has added the small-format production-quality micro-SLA ProJet 1200 from 3D Systems to its range of rapid-prototyping 3D printers. A low-cost professional-grade printer it is the first product in the RS 3D printer range to use stereolithography (SLA) technology, which delivers a smoother finish and builds layers that are less visible compared to alternative low-cost 3D printer technologies such as Fused Filament Fabrication (FFF).
Ginsbury to supply embedded computing solutions from Toradex
Luso Electronics stocks rugged SynQor RailQor EN50155 and RIA 12 compliant DC-DC converters
Capacitors from Kemet for high temperature automotive applications available from TTI
Conrad builds on partnership with Phoenix Contact with increased product range
Wireless & Communications
IDT introduces radio frequency switch with ultra-high isolation and linearity
Integrated Device Technology (IDT) has introduced the F2912 switch, the first in a line of new radio frequency (RF) switch products planned by the semiconductor company. The F2912 offers a combination of low insertion loss, high isolation and linearity making it suitable for base stations (2G, 3G and 4G), microwave backhaul and front haul, test equipment, CATV headend, WiMAX radios, wireless systems and general switching applications.
Renesas Electronics Europe adds communications to metering applications
ET market set for rapid growth to 4 billion units by 2018
Qualcomm looks to bring faster Wi-Fi connectivity to home networks and consumer electronics
Radiometrix launches frequency programmable Narrow Band Transmitter
Blu Wireless Technology confirms new $3.7m investment
The 60GHz wireless specialist, Blu Wireless has closed a $3.7m (£2.3m) funding round lead by a major international customer intending to exploit the company’s HYDRA baseband System IP for new 60GHz applications in 2016. The investment included $0.7m (£0.4m) follow-on funding from existing investors.
Digital power consortium formed by CUI, Ericsson Power Modules and Murata
Significant improvement in wear resistance from nanodiamond-enhanced electroless nickel plating
Smartphone connectivity creates opportunities and challenges for automotive processor chip suppliers
NXP to deliver V2X chipset for mass-production secure connected cars
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