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Components in Electronics

ICs & Semiconductors

Samsung launches first 28-megapixel APS-C CMOS image sensor for digital cameras

Samsung Electronics has announced its new 28 megapixel (MP) APS-C CMOS image sensor for digital cameras. Currently in mass production, the new S5KVB2 is designed into Samsung’s new compact system camera, the NX1. Utilizing Samsung’s advanced BSI pixel technology, the new S5KVB2 sensor is able to offer superior light absorption and by using a 65-nanometer (nm) low-power copper process as well as fine design technology, this new imager is able to meet the requirements for power efficiency and noiseless high quality imaging in high-end compact system camera formats.

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ON Semiconductor unveils SiP solution for precision-sensing in portable medical devices
ON Semiconductor has introduced the Struix, a semi-customisable System-in-Package (SiP) solution, for precision sensing and monitoring in a variety of mobile medical electronics including glucose monitors, heart rate monitors and electrocardiogram analysers. The product is a response to the rapidly-evolving product development demands from within the portable medical market.

Silicon Labs expands digital radio receiver family
Silicon Labs has expanded its Si468x digital radio IC family to include new options for AM and AM HD Radio. The Si468x ICs are the most cost-effective single-chip digital radio receivers available that support worldwide radio reception and are certified for the Digital Radio Tick Mark and AM/FM HD Radio. The industry’s first monolithic, CMOS-based antenna-input-to-audio-output digital radio ICs, the Si468x receivers are suitable for portable and consumer electronics products supporting digital radio standards.

Distribution

RS Components expands 3D printing range
RS Components (RS) has announced the availability of high quality 3D printing filaments from Verbatim. These top brand PLA and ABS filaments extend the RS 3D print offering to further benefit engineers in the rapid prototyping of their designs. The Verbatim PLA and ABS ranges are available in 1.75mm diameter filament. The PLA range is also supplied in 3mm diameter filament.

Wireless & Communications

Peregrine extends high-frequency portfolio
Peregrine Semiconductor is extending its high frequency portfolio with the introduction of the UltraCMOS PE42542 and PE42543 18 GHz SP4T broadband RF switches. This expansion of the company’s high-frequency portfolio represents the first RF SOI switches to deliver a high-performance alternative to incumbent gallium arsenide (GaAs) technology.

Circuit Components

Thermal Transfer Sheet offers high performance alternative to Thermal Pastes
UK based ARCOL Resistors, a specialist resistor supplier, has announced the availability of its TGR200 Thermal Transfer Sheet. TGR200 is a no-shrink, 100% coverage, no mess alternative to conventional thermal pastes which can be easily trimmed to required sizes with minimal wastage.

Display

Ginsbury supports high speed PCIe, dual-channel frame grabbers from Unigraf
Display specialist Ginsbury has announced the introduction of a dual-channel frame grabber from Finland based video and test equipment manufacturer, Unigraf. The UFG-07 HS Dual features a 4-channel PCI Express bus interface and is the latest addition to Unigraf's versatile, all-in-one UFG-07 series frame grabber family. The UFG-07 Dual is intended for users who need to capture two simultaneous, high resolution video streams from varying sources.

Power

Highly integrated battery cell controller from Freescale
Freescale Semiconductor has announced a highly integrated 14-cell lithium-ion battery cell controller for industrial and automotive applications, designed to cost effectively meet the stringent requirements for ASIL-C functional safety. With fourteen cell balancing transistors, a current sensor with ±0.5% accuracy from milliamps to kiloamps, and 2 Mbps communication transceiver interface integrated into a single 64-pin QFP package, the device is able to deliver robust, reliable performance for 48 V battery systems, enabling economical scalability beyond 1000 volts.

News

Raytheon UK and Newcastle University team to investigate silicon carbide interface defects
Raytheon UK’s semiconductor business unit in Glenrothes, Scotland, has embarked on a Knowledge Transfer Partnership (KTP) project, in conjunction with researchers at Newcastle University, to enhance the performance of Silicon Carbide (SiC) electronic devices, specifically for Raytheon’s own SiC CMOS process.

Video Feature

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