Murata's GW new series of multilayer ceramic capacitors is the world's first to comply to the Japanese standard JEITA RCX-2326. This standard specifies capacitance under actual operating conditions including temperature and DC voltage. Murata has succeeded in achieving higher capacitance with the GW series under these conditions compared with previous models of multilayer ceramic capacitors. The GW series is suitable for decoupling capacitor use in power supply circuits for low voltage driven devices and CPUs, FPGAs and similar applications.

austriamicrosystems has launched the AS3645 LED flash driver, an inductive, ultra small, high-efficiency single/dual LED flash driver that offers 25 per cent higher output current than existing equivalents. The higher flash power enhances picture and video quality especially in low light environments at same system size.

Eight new analogue-to-digital/digital-to-analogue boards based on the FPGA mezzanine card standard (FMC) have been unveiled by 4DSP. These latest boards are based on the new open industry standard developed by a consortium of companies working through the ANSI/VITA organisations, as defined in the ANSI/VITA 57.1.2008 specification.  FMC modules are designed to connect to FMC compliant carrier cards in the CompactPCI, VPX or PCI express form factors.

Aerco is now supplying the Hypertac HBB range of single-pole, circular connectors that combine high current handling capability with small size and exceptional environmental performance. Designed for use in all types of high-power applications, the HBB series is particularly suitable for electric drives used in fighting vehicles, unmanned aerial vehicles, weapon systems, ground-based and airborne avionic systems, rail transport and in the automotive and medical sectors.

STMicroelectronics has unveiled an innovative plastic air-cavity package that could enable high-power transistors for Radio-Frequency (RF) applications such as transceivers, broadcast equipment and MRI scanners to deliver performance and cost advantages over alternative devices in ceramic packages.

Air-cavity packages provide high electrical isolation for silicon die, and are well suited for high-frequency, high-power applications. Whereas the traditional package body is typically ceramic, to withstand high-temperature soldering during package assembly, this new air-cavity technology now enables lower thermal resistance, lower weight, and reduced cost compared to devices in ceramic packages.

Molex Incorporated has announced that its heavy-duty TM-4000 Universal Crimp Press provides up to 31 kN (7000lbf) for bench-top crimping large lug products of up to 4 AWG.

The TM-4000 Universal Crimp Press is an inexpensive, electrically controlled, direct-drive press designed for mid-volume, semi-automatic bench-top operations such as those found in the automotive, industrial and commercial markets. Capable of production rates of up to 2,400 terminations per hour, the TM-4000 offers contract manufacturers, assembly houses and design engineers an effective and affordable method of applying a wide range of side- and rear-feed terminals to heavy-gauge wires.

SiGe Semiconductor has launched the SE2576L, a 2.4GHz Wireless LAN power amplifier (PA) module. The new IEEE 802.11bgn device is the industry's smallest and most efficient power amplifier operating at 26dBm. The SE2576L targets applications requiring high RF transmit power such as residential video and data transport, enterprise and outdoor networks as well as public hotspots, delivering complete area coverage and improved link budgets for more effective broadband data services.

Powersolve has added to its energy efficient power supply portfolio with the introduction of the new PAK75-200 Series. These efficient, single output units feature a no-load power consumption of <0.7W and meet relevant Energy Star requirements. These units have been designed to provide high reliability and a long MTBF with every unit undergoing a full load burn-in test.