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Components in Electronics

Power

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New series of radiation hardened DC-DC power conversion products for space power systems

VPT Inc., a HEICO company, is making available a new series of radiation hardened DC-DC power converters, point of load converters, and EMI filters to power space systems. The new SVR Series of space power products includes 24 new modules in 7 product families, all based on space-proven heritage designs and available qualified to MIL-PRF-38534 Class K and are the first power conversion products commercially available that are out-of-the-box compliant to the new Aerospace Technical Operating Report (TOR) requirements for space power systems.

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Murata introduces 420W PMBus compliant 1/4 brick
Murata has introduced the UDQ series of isolated digitally controlled DC-DC converters developed by Murata Power Solutions. Incorporating a 32-bit ARM7 processor, the 420 Watt regulated UDQ2204/001 model is the first in a series of DC-DC converters from the company to include a PMBus compatible digital interface.

Highly integrated PFC IC for compact consumer products and PCs
Power Integrations has introduced the HiperPFS-2, a new family of high-efficiency, active-PFC ICs for offline applications from 100 W to 380 W. HiperPFS-2 ICs combine a boost PFC controller, driver, PFC MOSFET, PFC diode and protection circuits in one package, enabling exceptionally compact designs ideal for small-form-factor power supplies as used in mini-tower PCs, all-in-one PCs, game console adapters and TVs.

Circuit Components

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New line of industrial grade safety disc capacitors
KEMET, a manufacturer of tantalum, ceramic, aluminum, film, paper and electrolytic capacitors, has released a new Radial Through Hole Ceramic Safety Disc Capacitor targeting markets that include alternative energy, industrial/lighting, medical, and telecommunications. The Safety Discs Capacitors complement KEMET’s ERO610, ERK610, ERP610, KJY, KJN series, and FILM EMI suppression capacitors.

News

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ON Semiconductor gets development funding for next-generation Star Tracker image sensor
ON Semiconductor, in collaboration with SRI International and Ball Aerospace & Technologies, has secured funding for the Defense Production Act Title III, Advanced Complementary Metal Oxide Semiconductor (CMOS) Focal Plane Arrays (FPA) for Visible Sensors for Star Trackers (VSST) Project. The project aims to increase the availability of domestically produced visible imagers, manufactured using advanced CMOS technology, that are designed to enable flexible visible imaging systems for use on-board satellite systems for Department of Defense and other U.S. Government needs.

Wireless & Communications

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Dialog SmartBond Bluetooth low energy wireless connectivity chip unveiled
Dialog Semiconductor, a provider of integrated power management, audio and short-range wireless technologies, has launched SmartBond, said to be the world’s lowest power and smallest Bluetooth Smart System-on-Chip (SoC), which is able to more than double the battery life of an app-enabled smartphone accessory or computer peripheral in comparison to competing solutions currently on the market.

ICs & Semiconductors

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New OMAP5432 processor-based evaluation module targets industrial applications
In a move intended to help developers jumpstart their product designs, Texas Instruments (TI) has introduced the OMAP5432 processor-based evaluation module (EVM) for high-performance industrial applications. The EVM enables quick, easy evaluation and benchmarking for applications demanding high-performance processing and graphics at low power, including human machine interface (HMI), portable data terminals (PDT), digital signage and medical monitoring end equipment.

Profiles

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Gimme Five – Dunstan Power
Dunstan Power, director and co-founder of Bytesnap Design, talks to Steve Rogerson in our series of interviews for CIEonline. Having graduated with a degree in engineering from Cambridge University, Power has been working in the electronics industry since 1992. In 2004 he founded Diglis Design, an electronic design consultancy, where he developed a number of electronic boards and FPGA designs. In 2008, he teamed up with former colleague Graeme Wintle to establish Bytesnap Design to supply clients with integrated software development and embedded design services.

Distribution

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RS Components stocks Amphenol HD-BNC family
RS Components (RS) is stocking the High Density BNC (HD-BNC) family of connectors from Amphenol. With a footprint 51% smaller than traditional BNC connectors, and 40% smaller than DIN 1.0/2.3, the HD-BNC allows four times as many interconnects as the BNC, and makes it possible to reduce equipment size and weight in applications requiring high definition resolution, such as in broadcast and digital video (HDTV), as well as in network routing and switching.

Video Feature

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