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Components in Electronics

ICs & Semiconductors

Automotive infotainment companion chip supports multimedia connectivity and camera devices

Toshiba Electronics Europe (TEE) has made a key addition to its extensive portfolio of solutions for the automotive market. The TC358791XBG automotive companion chip was created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car. The new companion chip supports the latest automotive Gigabit Ethernet AVB standard for a wide range of applications, such as front/rear/surround-view cameras, digital audio and transferring high-resolution video content to head-unit and rear-seat entertainment systems.

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Multi-output boost converter LED driver ICs with fault-tolerant protection
New from Allego MicroSystems Europe, the A8518 and A8519 are the latest additions to the company’s portfolio of LED driver ICs for LCD backlighting applications and are multi-output boost converter devices with built-in fault-tolerant protection.

Freescale introduces small integrated tire pressure monitoring system
Freescale Semiconductor has introduced the FXTH87, a tire pressure monitoring system (TPMS) family, which is the smallest integrated package TPMS solution currently available with a weight of just 0.3 grams. The family of devices is 50 percent smaller than competing products, helping designers reduce overall bill of materials costs.


EdgeMate Wire-to-Edgecard power connectors eliminate mating headers
Molex Incorporated’s 3.96mm pitch EdgeMate Wire-to-Edgecard power connectors eliminate the need for mating headers, resulting in cost and time savings. This system supports power applications of up to 7.0A with UL 94V-2 flammability rating requirements.


TVS Diode Array provides five channels of ESD protection in footprint that typically contains only one
Littelfuse has introduced the SP1012 Series TVS Diode Array (SPA Diodes), a miniature, five-channel 6.5pF, 15kV bidirectional TVS array for general-purpose electrostatic discharge (ESD) protection. The SP1012 Series packs five ESD diodes in a 0402-size (0.94mm x 0.61mm) flipchip package that would normally contain only one, so offering a 5x improvement over previous implementations.

Mobile interference hunting system makes locating interferers faster and easier
Anritsu Company has unveiled what it describes as a revolutionary mobile interference hunting system that will helps field engineers and technicians locate sources of interference more accurately, efficiently, and economically. Integrating an easy-to-use interface, fast setup times, and numerous features to effectively hunt a variety of signal types in multiple RF environments, the comprehensive solution provides wireless carriers, regulatory agencies, and broadcast and satellite operators with a tool that saves time and money.


RS Components adds to its range of rapid-prototyping 3D print machines
RS Components (RS) has added the small-format production-quality micro-SLA ProJet 1200 from 3D Systems to its range of rapid-prototyping 3D printers. A low-cost professional-grade printer it is the first product in the RS 3D printer range to use stereolithography (SLA) technology, which delivers a smoother finish and builds layers that are less visible compared to alternative low-cost 3D printer technologies such as Fused Filament Fabrication (FFF).

Wireless & Communications

IDT introduces radio frequency switch with ultra-high isolation and linearity
Integrated Device Technology (IDT) has introduced the F2912 switch, the first in a line of new radio frequency (RF) switch products planned by the semiconductor company. The F2912 offers a combination of low insertion loss, high isolation and linearity making it suitable for base stations (2G, 3G and 4G), microwave backhaul and front haul, test equipment, CATV headend, WiMAX radios, wireless systems and general switching applications.


Blu Wireless Technology confirms new $3.7m investment
The 60GHz wireless specialist, Blu Wireless has closed a $3.7m (£2.3m) funding round lead by a major international customer intending to exploit the company’s HYDRA baseband System IP for new 60GHz applications in 2016. The investment included $0.7m (£0.4m) follow-on funding from existing investors.

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