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Components in Electronics

ICs & Semiconductors

IDT releases first IEEE 1588 time and frequency generators transparently disciplined by synchronous ethernet

Integrated Device Technology has introduced a family of IEEE 1588 time and frequency generator chips that not only reduce costs but also meet the synchronization needs of LTE-Advanced, wireless backhaul and heterogeneous networks. The device architecture and capabilities are fully documented and accessible to allow IEEE 1588 software designers to implement their own clock recovery algorithms and add value for their customers through customisation and quick turnaround support.

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Dialog Semiconductor latest power supply IC can deliver 60W from a 40W design
Dialog Semiconductor has released a new iW1770 PrimAccurate primary-side controller that is able to offer a 60W peak power mode from a 40W supply, eliminating the need to oversize the power supply design and enabling compact, light-weight, high power density adapters for Ultrabooks, network devices and other home electronics products.

X-REL Semiconductor extends oscillator range
X-REL Semiconductor, a specialist in high reliability and extreme temperature integrated circuits, has broadened its clock and timing product line by introducing a low-power, small foot-print crystal oscillator driver, XTR60010. Intended for operation in high-reliability, extreme temperature and extended lifetime systems, the XTR60010 is tailored for crystal oscillators, clock generation, clock buffering, frequency division and precision timing applications, with supply voltages from 2.5V to 5.5V and with crystals from 32kHz to 50MHz.


Hammond agreement extends Anglia enclosure range
Anglia Components is significantly expanding its diecast aluminium and plastic enclosures with its appointment as a UK and Ireland distributor for Hammond Manufacturing. Under the new agreement, Anglia will stock a broad range of Hammond’s diecast aluminium, extruded aluminium and plastic enclosures.


FCI introduces the BarKlip cable I/O
FCI, a supplier of connectors and interconnect systems, has announced the release of the BarKlip I/O Power Connector. The BarKlip I/O connector, rated for up to 200Amps/contact per UL & CSA criteria, offers improved electrical performance and long-term reliability compared with alternative designs.


Smartphone connectivity creates opportunities and challenges for automotive processor chip suppliers
The use of smartphones in motor vehicles—already a near-ubiquitous phenomenon—is currently the most disruptive trend in the automotive infotainment business, presenting both challenges and opportunities for automakers and their processor semiconductor suppliers, according to a new report from IHS Technology.


Wireless & Communications

Anritsu introduces field analyser with integrated PIM and line sweep testing capability
Anritsu Company has introduced the MW82119B PIM Master, a device which combines a 40W, battery-operated PIM analyser with a 2 MHz to 3 GHz cable and antenna analyser, eliminating the need to carry multiple instruments to measure the RF performance of a cell site.

Circuit Components

KEMET introduces new high temperature ceramic capacitors
KEMET has introduced a new High Temperature Radial Molded Multilayer Ceramic Capacitor which can operate in extreme environments and high temperature up to 200 degrees Celsius. The gold-plated lead wires of these components can withstand extreme temperatures while the epoxy molded case provides environmental protection and mechanical durability.

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