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ICs & Semiconductors
Samsung launches first 28-megapixel APS-C CMOS image sensor for digital cameras
Samsung Electronics has announced its new 28 megapixel (MP) APS-C CMOS image sensor for digital cameras. Currently in mass production, the new S5KVB2 is designed into Samsung’s new compact system camera, the NX1. Utilizing Samsung’s advanced BSI pixel technology, the new S5KVB2 sensor is able to offer superior light absorption and by using a 65-nanometer (nm) low-power copper process as well as fine design technology, this new imager is able to meet the requirements for power efficiency and noiseless high quality imaging in high-end compact system camera formats.
ON Semiconductor unveils SiP solution for precision-sensing in portable medical devices
ON Semiconductor has introduced the Struix, a semi-customisable System-in-Package (SiP) solution, for precision sensing and monitoring in a variety of mobile medical electronics including glucose monitors, heart rate monitors and electrocardiogram analysers. The product is a response to the rapidly-evolving product development demands from within the portable medical market.
Silicon Labs expands digital radio receiver family
Silicon Labs has expanded its Si468x digital radio IC family to include new options for AM and AM HD Radio. The Si468x ICs are the most cost-effective single-chip digital radio receivers available that support worldwide radio reception and are certified for the Digital Radio Tick Mark and AM/FM HD Radio. The industry’s first monolithic, CMOS-based antenna-input-to-audio-output digital radio ICs, the Si468x receivers are suitable for portable and consumer electronics products supporting digital radio standards.
Toshiba unveils sensor enabling high-megapixel camera modules in ultra-thin mobile devices
IDT DDR4 chipset qualified for Intel Xeon Processor E5-2600 v3 platform launch
New TrueTouch Gen4X capacitive touchscreen controller comes with face detection feature
Low capacitance TVS diode array protects fragile ICs from ESD damage
Cypress introduces inexpensive SuperSpeed Explorer Kit to accelerate USB 3.0 designs
Toshiba launches low-profile photocouplers for driving IGBTs and power MOSFETs
RS Components expands 3D printing range
RS Components (RS) has announced the availability of high quality 3D printing filaments from Verbatim. These top brand PLA and ABS filaments extend the RS 3D print offering to further benefit engineers in the rapid prototyping of their designs. The Verbatim PLA and ABS ranges are available in 1.75mm diameter filament. The PLA range is also supplied in 3mm diameter filament.
TTI Europe stocks industrial mini I/O connectors from TE Connectivity
Long-range Bluetooth Smart modules available from Solid State Supplies
Transonics unveils new QUICK TURN PCB Service
Conrad offering high-density industrial I/O modules
Wireless & Communications
Peregrine extends high-frequency portfolio
Peregrine Semiconductor is extending its high frequency portfolio with the introduction of the UltraCMOS PE42542 and PE42543 18 GHz SP4T broadband RF switches. This expansion of the company’s high-frequency portfolio represents the first RF SOI switches to deliver a high-performance alternative to incumbent gallium arsenide (GaAs) technology.
New microwave variable attenuators deliver exceptional performance
Dialog extends Bluetooth into growing range of HMI devices for the Smart home
Toshiba introduces close proximity, high speed wireless transfer technology for consumers in Europe
CSR and Lenovo deliver fully featured Bluetooth Smart television remote control
Thermal Transfer Sheet offers high performance alternative to Thermal Pastes
UK based ARCOL Resistors, a specialist resistor supplier, has announced the availability of its TGR200 Thermal Transfer Sheet. TGR200 is a no-shrink, 100% coverage, no mess alternative to conventional thermal pastes which can be easily trimmed to required sizes with minimal wastage.
IQD’s new specialist high shock oscillator also delivers high temperature performance
KEMET expands polymer hermetic seal portfolio
Riedon goes green with low cost DC current shunts rated up to 1200A
DLI’s power divider for low power applications of in-phase combining or splitting
Ginsbury supports high speed PCIe, dual-channel frame grabbers from Unigraf
Display specialist Ginsbury has announced the introduction of a dual-channel frame grabber from Finland based video and test equipment manufacturer, Unigraf. The UFG-07 HS Dual features a 4-channel PCI Express bus interface and is the latest addition to Unigraf's versatile, all-in-one UFG-07 series frame grabber family. The UFG-07 Dual is intended for users who need to capture two simultaneous, high resolution video streams from varying sources.
Toshiba launches ultra-compact white LEDs in 3535 lens type package
PanelPilotACE slashes development time and cost for advanced displays
FTDI Chip extends EVE portfolio with new software tools & Arduino libraries
Stadium IGT LED backlit capacitive switch module for OEM designers
Highly integrated battery cell controller from Freescale
Freescale Semiconductor has announced a highly integrated 14-cell lithium-ion battery cell controller for industrial and automotive applications, designed to cost effectively meet the stringent requirements for ASIL-C functional safety. With fourteen cell balancing transistors, a current sensor with ±0.5% accuracy from milliamps to kiloamps, and 2 Mbps communication transceiver interface integrated into a single 64-pin QFP package, the device is able to deliver robust, reliable performance for 48 V battery systems, enabling economical scalability beyond 1000 volts.
Configurable PMIC from ams supports platform designs for li-ion battery-powered devices
CAPZero X-capacitor discharge ICs certified to IEC 62368 standard for TVs & IT equipment
New USB 3.1 Type-C power delivery solution speeds USB connector development
TI advances ultra-low power conversion for wearable, sensor and industrial designs
Raytheon UK and Newcastle University team to investigate silicon carbide interface defects
Raytheon UK’s semiconductor business unit in Glenrothes, Scotland, has embarked on a Knowledge Transfer Partnership (KTP) project, in conjunction with researchers at Newcastle University, to enhance the performance of Silicon Carbide (SiC) electronic devices, specifically for Raytheon’s own SiC CMOS process.
Huawei selects TrueTouch Gen5 touchscreen controller for MediaPad X1 tablet
Microsemi to acquire Centellax
Renesas establishes R-IN Consortium to support industrial ethernet equipment development
Microlease launches certified pre-owned programme
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